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Ramani Mayappan
Ramani Mayappan
Senior Lecturer, Universiti Teknologi MARA, Perlis
Verified email at uitm.edu.my
Title
Cited by
Cited by
Year
Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder
R Mayappan, ZA Ahmad
Intermetallics 18 (4), 730-735, 2010
872010
The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate
R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain
Journal of alloys and compounds 436 (1-2), 112-117, 2007
452007
Effect of sample perimeter and temperature on Sn–Zn based lead-free solders
R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain
Materials Letters 60 (19), 2383-2389, 2006
352006
The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate
R Mayappan, I Yahya, NA Ab Ghani, HA Hamid
Journal of Materials Science: Materials in Electronics 25 (7), 2913-2922, 2014
312014
Phase development in La2O3 doped Al2O3: TiO2 ceramic membranes
US Bjoerkert, R Mayappan, D Holland, MH Lewis
Journal of the European Ceramic Society 19 (10), 1847-1857, 1999
191999
Improvement in intermetallic thickness and joint strength in carbon nanotube composite Sn-3.5 Ag lead-free solder
R Mayappan, AA Hassan, NA Ab Ghani, I Yahya, J Andas
Materials Today: Proceedings 3 (6), 1338-1344, 2016
152016
Wetting and intermetallic study between Sn-3.5 Ag-1.0 Cu-xZn lead-free solders and copper substrate (x= 0, 0.1, 0.4, 0.7)
R Mayappan
Advanced Materials Research 501, 150-154, 2012
132012
Temperature and flux effect on contact angles and intermetallic between Sn-8Zn-3Bi lead-free solder and Cu substrate
R Mayappan, ZA Ahmad
Sains Malaysiana 38, 2009
122009
Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route
MRAZA Mohd Salleh M. A. A., Zan @ Hazizi M. H., Mustafa
Advanced Materials Research 626, 791-796, 2013
102013
Advanced Materials Research 626
M Salleh, MH Hazizi, M Abdullah, N Noriman, R Mayapan, ZA Ahmad
Go to reference in article, 2012
102012
Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint During Liquid State Aging
R Mayappan, RA Zaman, ZZ Abidin
92011
Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders
R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain
Jurnal Teknologi 46, 1–14, 2007
9*2007
The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder
R Mayappan, NAA Ghani, I Yahya
AIP Conference Proceedings 2031 (1), 020016, 2018
42018
Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder
R Mayappan, NA Jasli
Materials Today: Proceedings 5 (9), 17553-17560, 2018
42018
Intermetallic growth retardation with the addition of graphene in the Sn-3.5 Ag lead-free solder
R Mayappan, A Salleh
IOP Conference Series: Materials Science and Engineering 205 (1), 012017, 2017
42017
Intermetallic evolution of Sn-3.5 Ag-1.0 Cu-0.1 Zn/Cu interface under thermal aging
I Yahya, NA Ab Ghani, NNZ Abiddin, H Abd Hamid, R Mayappan
Advanced Materials Research 620, 142-146, 2013
42013
Morphology and Intermetallics Study of (Sn-8Zn-3Bi)-1Ag Solder under Liquid-State Aging
NA Jasli, H Abd Hamid, R Mayappan
Advanced Materials Research 620, 273-277, 2013
42013
Characterization of Sn-3.5 Ag-1.0 Cu lead-free solder prepared via powder metallurgy method
I Yahya, NA Ab Ghani, MAA Mohd Salleh, H Abd Hamid, ZA Ahmad, ...
Advanced Materials Research 501, 160-164, 2012
42012
The effect of graphene on the intermetallic and joint strength of Sn-3.5 Ag lead-free solder
R Mayappan, A Salleh, J Andas
AIP Conference Proceedings 1877 (1), 050004, 2017
32017
MICROSTRUCTURAL EVOLUTION AND GROWTH KINETICS OF Sn-40Pb/Cu SOLDER JOINT DURING LONG-TERM AGING AT 125 O C
R Mayappan, AB Ismail, ZA Ahmad
Journal of Nuclear and Related Technologies 6 (1), 165-172, 2009
32009
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