| Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo Thin solid films 462, 370-375, 2004 | 266 | 2004 |
| Electromigration induced ductile-to-brittle transition in lead-free solder joints F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang Applied physics letters 89 (14), 2006 | 146 | 2006 |
| Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder JHL Pang, BS Xiong, TH Low 2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004 | 146 | 2004 |
| Low cycle fatigue models for lead-free solders JHL Pang, BS Xiong, TH Low Thin solid films 462, 408-412, 2004 | 145 | 2004 |
| Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy JHL Pang, BS Xiong, TH Low International Journal of Fatigue 26 (8), 865-872, 2004 | 116 | 2004 |
| Bulk solder and solder joint properties for lead free 95.5 Sn-3.8 Ag-0.7 Cu solder alloy JHL Pang, BS Xiong, CC Neo, XR Mang, TH Low 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 116 | 2003 |
| Mechanical properties for 95.5 Sn–3.8 Ag–0.7 Cu lead-free solder alloy JHL Pang, BS Xiong IEEE Transactions on components and packaging Technologies 28 (4), 830-840, 2005 | 102 | 2005 |
| Modeling stress strain curves for lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder JHL Pang, BS Xiong, FX Che 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 51 | 2004 |
| Design for reliability (DFR) methodology for electronic packaging assemblies JHL Pang, TH Low, BS Xiong, F Che Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 50 | 2003 |
| Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies FX Che, JHL Pang, BS Xiong, L Xu, TH Low Proceedings Electronic Components and Technology, 2005. ECTC'05., 916-921, 2005 | 47 | 2005 |
| Ag content effect on mechanical properties of Sn-xAg-0.5 Cu solders FX Che, EC Poh, WH Zhu, BS Xiong 2007 9th Electronics Packaging Technology Conference, 713-718, 2007 | 46 | 2007 |
| Lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder joint reliability analysis for micro-BGA assembly JHL Pang, PTH Low, BS Xiong The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004 | 32 | 2004 |
| Comprehensive mechanics characterization of lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder JHL Pang, BS Xiong, TH Low Micromaterials and Nanomaterials 3, 86-93, 2004 | 30 | 2004 |
| Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array) DYR Chong, FX Che, JHL Pang, L Xu, BS Xiong, HJ Toh, BK Lim IEEE Transactions on Advanced Packaging 31 (1), 66-75, 2008 | 26 | 2008 |
| Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP) DYR Chong, HJ Toh, BK Lim, PTH Low, JHL Pang, FX Che, BS Xiong, ... 2005 7th Electronic Packaging Technology Conference 1, 8 pp., 2005 | 21 | 2005 |
| Effect of electromigration on mechanical behavior of solder joints F Ren, JW Nah, JO Suh, KN Tu, BS Xiong, LH Xu, JHL Pang Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 19 | 2005 |
| Warpage improvement for large die flip chip package B Xiong, MJ Lee, T Kao 2009 11th Electronics Packaging Technology Conference, 40-43, 2009 | 16 | 2009 |
| Microvia reliability improvement for high density interconnect substrate B Xiong, KW Loo, K Nagarajan 2011 IEEE 13th Electronics Packaging Technology Conference, 138-141, 2011 | 5 | 2011 |
| Mechanics of materials characterization of lead-free solders B Xiong | 3 | 2005 |
| In-situ electromigration studies on Sn-Ag-Cu solder joint by digital image speckle analysis (DISA) L Xu, JHL Pang, BS Xiong Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 1 | 2004 |
