| Managing knowledge effectively F Hussain, C Lucas, M Ali Journal of Knowledge Management Practice 5 (1), 1-12, 2004 | 141 | 2004 |
| Relationship between extreme temperature and electricity demand in Pakistan M Ali, MJ Iqbal, M Sharif International Journal of Energy and Environmental Engineering 4, 1-7, 2013 | 60 | 2013 |
| Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali Microelectronics Reliability 72, 45-64, 2017 | 36 | 2017 |
| Impacts of information technology on E-Learning system in Pakistan M Ali, A Ahmed, AW Shaikh, AHS Bukhari Sindh University Research Journal-SURJ (Science Series) 43 (1 (a)), 2011 | 18 | 2011 |
| A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process FC Ng, MYT Ali, A Abas, CY Khor, Z Samsudin, MZ Abdullah The International Journal of Advanced Manufacturing Technology 105, 3521-3530, 2019 | 15 | 2019 |
| Benchmark exercise on image-based permeability determination of engineering textiles: Microscale predictions E Syerko, T Schmidt, D May, C Binetruy, SG Advani, S Lomov, L Silva, ... Composites Part A: Applied Science and Manufacturing 167, 107397, 2023 | 14 | 2023 |
| Stress analysis of a stretchable electronic circuit AA Norhidayah, AA Saad, MFM Sharif, FC Ani, MYT Ali, MS Ibrahim, ... Procedia engineering 184, 625-630, 2017 | 13 | 2017 |
| Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies MN Nashrudin, ZL Gan, A Abas, MHH Ishak, MYT Ali Soldering & Surface Mount Technology 32 (3), 147-156, 2020 | 10 | 2020 |
| Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process S Zulfiqar, AA Saad, MFM Sharif, Z Samsudin, MYT Ali, FC Ani, Z Ahmad, ... Microelectronics Reliability 127, 114373, 2021 | 9 | 2021 |
| Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF) C Sarveswaran, EM Salleh, A Jalar, Z Samsudin, M Ali, FC Ani, ... AIP Conference Proceedings 1838 (1), 2017 | 9 | 2017 |
| Investigation of electrochemical migration on Sn-0.7 Cu-0.3 Ag-0.03 P-0.005 Ni solder alloy in HNO3 solution C Sarveswaran, NK Othman, M Ali, FC Ani, Z Samsudin AIP Conference Proceedings 1678 (1), 2015 | 9 | 2015 |
| Control Strategies for Robot Therapy A Ali, SF Ahmed, MK Joyo, A Malik, M Ali, K Kadir, ZM YUSOF | 8 | 2017 |
| Structural and random vibration analysis of LEDs conductive polymer interconnections S Zulfiqar, AA Saad, MAW Chek, MFM Sharif, Z Samsudin, MYT Ali IOP Conference Series: Materials Science and Engineering 815 (1), 012003, 2020 | 7 | 2020 |
| Study of different dispensing patterns of No-flow underfill using numerical and experimental methods MN Nashrudin, A Abas, MZ Abdullah, MYT Ali, Z Samsudin Journal of Electronic Packaging 143 (3), 031005, 2021 | 5 | 2021 |
| No-flow underfill: effect of chip placement speed on the void formation using numerical method MN Nashrudin, A Abas, MZ Abdullah, MYT Ali, Z Samsudin, I Mansor Microelectronics Journal 114, 105139, 2021 | 5 | 2021 |
| A study on a stretchable conductive polymer of thermoplastic automotive device MFM Sharif, AA Saad, MK Abdullah, NA Aziz, NA Ismail, FC Ani, MYT Ali, ... 2018 IEEE 38th International Electronics Manufacturing Technology Conference …, 2018 | 5 | 2018 |
| A study on thermoforming process of stretchable circuit and its performance in manufacturing of automotive lighting MFM Sharif, AA Saad, MZ Abdullah, FC Ani, MYT Ali, MK Abdullah, ... AIP Conference Proceedings 1901 (1), 2017 | 5 | 2017 |
| Influence of varying levels of bergafat on performance of broiler chicks. M Ali, M Sharif, JI Sultan, S Rehman, K Farooq, ML Khan | 5 | 2012 |
| Effective network intrusion detection using stacking-based ensemble approach M Ali, M Haque, MH Durad, A Usman, SM Mohsin, H Mujlid, C Maple International Journal of Information Security 22 (6), 1781-1798, 2023 | 4 | 2023 |
| Prediction of the void formation in no-flow underfill process using machine learning-based algorithm MN Nashrudin, FC Ng, A Abas, MZ Abdullah, MYT Ali, Z Samsudin Microelectronics Reliability 135, 114586, 2022 | 4 | 2022 |
