| Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes LC Sim, SR Ramanan, H Ismail, KN Seetharamu, TJ Goh Thermochimica acta 430 (1-2), 155-165, 2005 | 594 | 2005 |
| Thermal stability and electrical behavior of polydimethylsiloxane nanocomposites with carbon nanotubes and carbon black fillers M Norkhairunnisa, A Azizan, M Mariatti, H Ismail, LC Sim Journal of Composite Materials 46 (8), 903-910, 2012 | 96 | 2012 |
| Effects of the size and filler loading on the properties of copper‐and silver‐nanoparticle‐filled epoxy composites KL Chan, M Mariatti, Z Lockman, LC Sim Journal of Applied Polymer Science 121 (6), 3145-3152, 2011 | 61 | 2011 |
| Cure characteristics, mechanical and thermal properties of Al2O3 and ZnO reinforced silicone rubber LC Sim, CK Lee, SR Ramanan, H Ismail, KN Seetharamu Polymer-Plastics Technology and Engineering 45 (3), 301-307, 2006 | 36 | 2006 |
| Properties of epoxy nanocomposite thin films prepared by spin coating technique R Voo, M Mariatti, LC Sim Journal of Plastic Film & Sheeting 27 (4), 331-346, 2011 | 35 | 2011 |
| Properties of spin coated epoxy/silica thin film composites: Effect of nano-and micron-size fillers E Foo, M Jaafar, A Aziz, LC Sim Composites Part A: Applied Science and Manufacturing 42 (10), 1432-1437, 2011 | 32 | 2011 |
| Flexibility improvement of epoxy nanocomposites thin films using various flexibilizing additives R Voo, M Mariatti, LC Sim Composites Part B: Engineering 43 (8), 3037-3043, 2012 | 29 | 2012 |
| Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application KL Chan, M Mariatti, Z Lockman, LC Sim Journal of Materials Science: Materials in Electronics 21, 772-778, 2010 | 29 | 2010 |
| Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application R Voo, M Mariatti, LC Sim Polymers for Advanced Technologies 23 (12), 1620-1627, 2012 | 16 | 2012 |
| Apparatus and methods of forming package-on-package interconnects L Arana, R Nickerson, LC Sim, E Prack, Y Tomita US Patent App. 12/215,550, 2009 | 9 | 2009 |
| Method of interconnecting workpieces L Arana, R Nickerson, LC Sim, E Prack, Y Tomita US Patent 7,971,347, 2011 | 6 | 2011 |
| Protective coating for mark preservation ML Oh, LC Sim US Patent App. 11/529,953, 2008 | 5 | 2008 |
| Tensile and Thermal Conductivity Properties of Epoxy Nanocomposites Thin Film by Spin Coating Technique TV Voo, M Mariatti, LC Sim Key Engineering Materials 471, 1118-1123, 2011 | 4 | 2011 |
| Fabrication of silica/epoxy thin film composite for electronic packaging application YLE Foo, M Mariatti, A Azizan, LC Sim 2010 34th IEEE/CPMT International Electronic Manufacturing Technology …, 2010 | 2 | 2010 |
| Solvent effect on the morphology of copper (I) oxide: A fundamental study towards copper (I) oxide-epoxy composites WL Tan, KY Chew, NHM Hirmizi, MA Bakar, J Ismail, LC Sim 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology …, 2008 | | 2008 |
| Properties of Epoxy/Silica Thin Film Composite for Electronic Application M Mariatti, YL Foo, A Azizan, LC Sim | | |
