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- Patrick Fayelectrical engineering, University of Notre DameVerified email at nd.edu
- Wu Lu, ProfessorThe Ohio State UniversityVerified email at osu.edu
- Liang WangUniversity of Illinois at Urbana-Champaign, Texas InstrumentsVerified email at ti.com
- Paul BohnChemical & Biomolecular Engineering, University of Notre DameVerified email at nd.edu
- Mohamed ArafaSr. Principal Engineer at Intel. Adjunct Professor at ASUVerified email at intel.com
- John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
- Deepak SelvanathanVerified email at intel.com
- James KolodzeyUniversity of DelawareVerified email at udel.edu
- Seong Tae-YeonProfessor of Materials Science, Korea UniversityVerified email at korea.ac.kr
- Han-Ki KimSungkyunkwan UniversityVerified email at skku.edu
- Roberto Ricardo PanepucciCornell University, Cornell Nanoscale Science and Technology Facility - CNFVerified email at cti.gov.br
- Sookyung ChoiIntel CorporationVerified email at intel.com
- Khalid IsmailprofessorVerified email at himangel.com
- Sung Mo KangUniversity of California, Santa CruzVerified email at ucsc.edu
- Matt MeitlX Display CompanyVerified email at xdisplay.com
- Grigory SiminUniversity of South CarolinaVerified email at engr.sc.edu
- Bernard MeyersonIBM, 4IRAdvisors, Senzing, NextSiliconVerified email at us.ibm.com
- Remis GaskaUVTON, Inc.Verified email at uvton.com
- Sean RommelProfessor, Rochester Institute of TechnologyVerified email at rit.edu
- Hooman MohseniNorthwestern UniversityVerified email at northwestern.edu