| Ammonium persulfate and potassium oleate containing silica dispersions for chemical mechanical polishing for cobalt interconnect applications CK Ranaweera, NK Baradanahalli, R Popuri, J Seo, SV Babu ECS Journal of Solid State Science and Technology 8 (5), P3001, 2018 | 57 | 2018 |
| Potassium oleate as a dissolution and corrosion inhibitor during chemical mechanical planarization of chemical vapor deposited Co films for interconnect applications R Popuri, H Amanapu, CK Ranaweera, NK Baradanahalli, SV Babu ECS Journal of Solid State Science and Technology 6 (12), P845, 2017 | 48 | 2017 |
| Formation of cobalt-BTA complexes and their removal from various surfaces relevant to cobalt interconnect applications J Seo, SH Vegi, CK Ranaweera, NK Baradanahalli, JH Han, D Koli, ... ECS Journal of Solid State Science and Technology 8 (5), P3009, 2018 | 36 | 2018 |
| Investigation of the impact of pad surface texture from different pad conditioners on the CMP performance AJ Khanna, M Yamamura, VR Kakireddy, A Chockalingam, P Jawali, ... ECS Journal of Solid State Science and Technology 9 (6), 064011, 2020 | 22 | 2020 |
| Soft chemical mechanical polishing pad for oxide CMP applications NB Kenchappa, R Popuri, A Chockkalingam, P Jawali, S Jayanath, ... ECS Journal of Solid State Science and Technology 10 (1), 014008, 2021 | 15 | 2021 |
| Engineering surface texture of pads for improving CMP performance of Sub-10 nm nodes AJ Khanna, VR Kakireddy, J Fung, M Yamamura, P Jawali, ... ECS Journal of Solid State Science and Technology 9 (10), 104003, 2020 | 13 | 2020 |
| High-performance pad conditioning (HPPC) arm for augmenting CMP performance AJ Khanna, VR Kakireddy, J Fung, P Jawali, M Yamamura, ... ECS Journal of Solid State Science and Technology 9 (6), 064012, 2020 | 10 | 2020 |
| Polishing pads having selectively arranged porosity MY Aniruddh Jagdish Khanna, Jason G Fung, Puneet Narendra Jawali, Rajeev ... US Patent App. 17/036,623, 2021 | 3* | 2021 |
| Polishing pads with interconnected pores SAJW GONNAGAHADENIYAGE, A CHOCKALINGAM, JG Fung, ... US Patent 11,951,590, 2024 | 1 | 2024 |
| Advanced polishing pads and related polishing pad manufacturing methods PN Jawali, NB KENCHAPPA, JG Fung, SAJW GONNAGAHADENIYAGE, ... US Patent 11,806,829, 2023 | 1 | 2023 |
| Formulation of Post Cobalt CMP Cleaning Solution Based on Stability Constants of Metal Complexes SH Vegi, J Seo, CK Ranaweera, NK Baradanahalli, SV Babu 2019 AIChE Annual Meeting, 2019 | 1 | 2019 |
| Advanced polishing pads and related polishing pad manufacturing methods PN Jawali, NB KENCHAPPA, JG Fung, SAJW GONNAGAHADENIYAGE, ... US Patent App. 18/480,060, 2024 | | 2024 |
| Polishing pads having selectively arranged porosity AJ Khanna, JG Fung, PN Jawali, R Bajaj, AW Manzonie, ... US Patent App. 18/377,073, 2024 | | 2024 |
| Development, Evaluation, and Characterization of CMP Pads for STI CMP Applications: A Dissertation NB Kenchappa Department of Chemical and Biomolecular Engineering Clarkson University, 2021 | | 2021 |
| Development, Evaluation, and Characterization of CMP Pads for STI CMP Applications N Baradanahalli Kenchappa Clarkson University, 2021 | | 2021 |
Puneet JawaliLam ResearchVerified email at lamresearch.com
