| Local bonding environments of Si–OH groups in SiO2 deposited by remote plasma‐enhanced chemical vapor deposition and incorporated by postdeposition … JA Theil, DV Tsu, MW Watkins, SS Kim, G Lucovsky Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8 (3 …, 1990 | 214 | 1990 |
| Chemical mechanical polishing for hybrid bonding GG Fountain Jr, C Mandalapu, CE Uzoh, JA Theil US Patent 10,840,205, 2020 | 102 | 2020 |
| Fluorinated amorphous carbon films for low permittivity interlevel dielectrics JA Theil Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1999 | 98 | 1999 |
| Carbon content of silicon oxide films deposited by room temperature plasma enhanced chemical vapor deposition of hexamethyldisiloxane and oxygen JA Theil, JG Brace, RW Knoll Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 12 (4 …, 1994 | 94 | 1994 |
| Interconnect structure with hard mask and low dielectric constant materials C Chiang, C Pan, VM Ochoa, S Fang, DB Fraser, JC Sum, GW Ray, ... US Patent 5,886,410, 1999 | 89 | 1999 |
| Effects of microstructure and nonstoichiometry on electrical properties of vanadium dioxide films E Kusano, JA Theil Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 7 (3 …, 1989 | 84 | 1989 |
| Interconnect structures CE Uzoh, GG Fountain Jr, JA Theil US Patent 11,158,573, 2021 | 81 | 2021 |
| Deposition of vanadium oxide films by direct‐current magnetron reactive sputtering E Kusano, JA Theil, JA Thornton Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 6 (3 …, 1988 | 80 | 1988 |
| Low temperature bonded structures CE Uzoh, JA Theil, L Wang, R Katkar, G Gao, LW Mirkarimi US Patent 10,790,262, 2020 | 69 | 2020 |
| Image sensor with pixel isolation system and manufacturing method therefor JA Theil, DW Vook, H Haddad US Patent 6,759,262, 2004 | 65 | 2004 |
| Elevated pin diode active pixel sensor including a unique interconnection structure JA Theil, M Cao, DW Vook, FA Perner, X Sun, S Ma, GW Ray US Patent 6,018,187, 2000 | 63 | 2000 |
| Molded direct bonded and interconnected stack G Gao, CE Uzoh, JA Theil, B Haba, R Katkar US Patent 11,158,606, 2021 | 61 | 2021 |
| Optical detection system for the detection of organic molecules JA Theil US Patent 6,325,977, 2001 | 59 | 2001 |
| Bonding surfaces for microelectronics JA Theil US Patent 11,056,348, 2021 | 58 | 2021 |
| Stacked multiple photosensor structure including independent electrical connections to each photosensor JA Theil US Patent 6,373,117, 2002 | 57 | 2002 |
| Low temperature Cu interconnect with chip to wafer hybrid bonding G Gao, L Mirkarimi, T Workman, G Fountain, J Theil, G Guevara, P Liu, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 628-635, 2019 | 51 | 2019 |
| Elevated image sensor array which includes isolation between the image sensors and a unique interconnection S Ma, JA Theil US Patent 5,936,261, 1999 | 51 | 1999 |
| Reaction pathways and sources of OH groups in low temperature remote PECVD silicon dioxide thin films JA Theil, DV Tsu, G Lucovsky Journal of electronic materials 19, 209-217, 1990 | 45 | 1990 |
| Electron and hole drift mobility measurements on thin film CdTe solar cells Q Long, SA Dinca, EA Schiff, M Yu, J Theil Applied Physics Letters 105 (4), 2014 | 42 | 2014 |
| Method for fabricating an interconnect structure with hard mask and low dielectric constant materials C Chiang, C Pan, VM Ochoa, S Fang, DB Fraser, JC Sum, GW Ray, ... US Patent 6,027,995, 2000 | 41 | 2000 |
