| Low-loss Si-substrates enhanced using buried PN junctions for RF applications M Rack, L Nyssens, JP Raskin IEEE Electron Device Letters 40 (5), 690-693, 2019 | 28 | 2019 |
| A SPDT RF switch small-and large-signal characteristics on TR-HR SOI substrates BK Esfeh, M Rack, S Makovejev, F Allibert, JP Raskin IEEE Journal of the Electron Devices Society 6, 543-550, 2018 | 28 | 2018 |
| Small-and large-signal performance up to 175° C of low-cost porous silicon substrate for RF applications M Rack, Y Belaroussi, KB Ali, G Scheen, BK Esfeh, JP Raskin IEEE Transactions on Electron Devices 65 (5), 1887-1895, 2018 | 23 | 2018 |
| SOI technologies for RF and millimeter-wave applications M Rack, JP Raskin Convergence of More Moore, More than Moore and Beyond Moore, 131-182, 2021 | 22 | 2021 |
| Post-process porous silicon for 5G applications G Scheen, R Tuyaerts, M Rack, L Nyssens, J Rasson, M Nabet, JP Raskin Solid-State Electronics 168, 107719, 2020 | 21 | 2020 |
| Effective resistivity extraction of low-loss silicon substrates at millimeter-wave frequencies L Nyssens, M Rack, JP Raskin International Journal of Microwave and Wireless Technologies 12 (7), 615-628, 2020 | 19 | 2020 |
| Modeling of semiconductor substrates for RF applications: Part I—Static and dynamic physics of carriers and traps M Rack, F Allibert, JP Raskin IEEE Transactions on Electron Devices 68 (9), 4598-4605, 2021 | 18 | 2021 |
| Silicon-substrate enhancement technique enabling high quality integrated RF passives M Rack, L Nyssens, JP Raskin 2019 IEEE MTT-S International Microwave Symposium (IMS), 1295-1298, 2019 | 16 | 2019 |
| Silicon-substrate enhancement technique enabling high quality integrated RF passives M Rack, L Nyssens, JP Raskin 2019 IEEE MTT-S International Microwave Symposium (IMS), 1295-1298, 2019 | 16 | 2019 |
| Engineering SOI substrates for RF to mm-wave front-ends F Allibert, L Andia, Y Morandini, C Veytizou, M Rack, L Nyssens, ... Microwave Journal, 72, 2020 | 15 | 2020 |
| Modeling of semiconductor substrates for RF applications: Part II—Parameter impact on harmonic distortion M Rack, F Allibert, JP Raskin IEEE Transactions on Electron Devices 68 (9), 4606-4613, 2021 | 13 | 2021 |
| DC-40 GHz SPDTs in 22 nm FD-SOI and back-gate impact study M Rack, L Nyssens, S Wane, D Bajon, JP Raskin 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 67-70, 2020 | 11 | 2020 |
| Ultra low-loss Si substrate for on-chip UWB GHz antennas N André, M Rack, L Nyssens, C Gimeno, D Oueslati, KB Ali, S Gilet, ... IEEE Journal of the Electron Devices Society 7, 393-397, 2019 | 11 | 2019 |
| High quality silicon-based substrates for microwave and millimeter wave passive circuits Y Belaroussi, M Rack, AA Saadi, G Scheen, MT Belaroussi, M Trabelsi, ... Solid-State Electronics 135, 78-84, 2017 | 11 | 2017 |
| On the separate extraction of self-heating and substrate effects in FD-SOI MOSFET L Nyssens, M Rack, A Halder, JP Raskin, V Kilchytska IEEE Electron Device Letters 42 (5), 665-668, 2021 | 10 | 2021 |
| RF small-and large-signal characteristics of CPW and TFMS lines on trap-rich HR-SOI substrates BK Esfeh, M Rack, KB Ali, F Allibert, JP Raskin IEEE Transactions on Electron Devices 65 (8), 3120-3126, 2018 | 8 | 2018 |
| RF harmonic distortion modeling in silicon-based substrates including non-equilibrium carrier dynamics M Rack, JP Raskin 2017 IEEE MTT-S International Microwave Symposium (IMS), 91-94, 2017 | 8 | 2017 |
| Noise coupling between TSVs and active devices: Planar nMOSFETs vs. nFinFETs X Sun, ARN Abadi, W Guo, KB Ali, M Rack, CR Neve, M Choi, V Moroz, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 260-265, 2015 | 8 | 2015 |
| Impact of III-N buffer layers on RF losses and harmonic distortion of GaN-on-Si Substrates P Cardinael, S Yadav, M Zhao, M Rack, D Lederer, N Collaert, B Parvais, ... ESSDERC 2021-IEEE 51st European Solid-State Device Research Conference …, 2021 | 7 | 2021 |
| Behavior of gold-doped silicon substrate under small-and large-RF signal M Nabet, M Rack, NZI Hashim, CHK de Groot, JP Raskin Solid-State Electronics 168, 107718, 2020 | 7 | 2020 |
Jean-Pierre RaskinUniversité catholique de Louvain, Engineering School of LouvainVerified email at uclouvain.be
