| Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder S Mukherjee, B Zhou, A Dasgupta, TR Bieler international Journal of Plasticity 78, 1-25, 2016 | 54 | 2016 |
| Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies S Mukherjee, M Nuhi, A Dasgupta, M Modarres Journal of Electronic Packaging, 2016 | 49 | 2016 |
| Effect of isothermal aging on microstructure and creep properties of SAC305 solder: a micromechanics approach P Chauhan, S Mukherjee, M Osterman, A Dasgupta, M Pecht International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 30 | 2013 |
| Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints S Mukherjee, P Chauhan, M Osterman, A Dasgupta, M Pecht Journal of Electronic Materials, 1-14, 2016 | 17 | 2016 |
| Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder S Mukherjee, A Dasgupta, B Zhou, TR Bieler Journal of Electronic Materials, 1-12, 2014 | 12 | 2014 |
| Mechanistic modeling of the anisotropic steady state creep response of SnAgCu single crystal S Mukherjee, B Zhou, A Dasgupta, TR Bieler International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 11 | 2015 |
| Effect of addition of manganese and antimony on viscoplastic properties and cyclic mechanical durability of low silver Sn-Ag-Cu solder S Mukherjee, TT Mattila, A Dasgupta 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 8 | 2012 |
| An evaluation of a modified iosipescu specimen for measurement of elastic-plastic properties of solder materials S Mukherjee, A Dasgupta ASME International Mechanical Engineering Congress and Exposition 44281, 351-356, 2010 | 7 | 2010 |
| Multiscale modeling of the anisotropic creep response of SnAgCu single crystal S Mukherjee University of Maryland, College Park, 2015 | 4 | 2015 |
| Mechanical constitutive properties of a bi-rich high temperature solder alloy Q Jiang, S Mukherjee, A Dasgupta, D Shaddock, L Yin 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 3 | 2016 |
| Durability assessment of photovoltaic (PV) products under environmental thermal cycling J Akman, C Choi, S Mukherjee, J Meng, E Mirbagheri, G Haddad, D Das, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 2 | 2012 |
| Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders Q Jiang, S Mukherjee, B Vogt, A Dasgupta, D Shaddock, L Yin International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 1 | 2015 |
| Effect of gold and copper on microstructural evolution and mechanical durability of SAC305 solder joints S Mukherjee, A Dasgupta, J Silk, LL Ong 2014 International Conference on Electronics Packaging (ICEP), 162-167, 2014 | 1 | 2014 |
| Inhibiting the Re-Deposition of AuSn4 on Au/Ni Metallization Pads by Varying the Accessibility of Cu in Isothermally Aged SAC305 Solder Joints S Mukherjee, A Dasgupta, J Silk, L Ong ASME International Mechanical Engineering Congress and Exposition 56390 …, 2013 | 1 | 2013 |
| Multiscale Creep modeling of the Effect of Micro-alloying Manganese into SACI05 Solder S Mukherjeel, A Dasgupta EuroSIME, Wroclaw, Poland, 2013 | 1 | 2013 |
Abhijit DasguptaProfessor of Mechanical Engineering, University of MarylandVerified email at umd.edu
