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Co-authors
- Cristian ZambelliAssociate Professor, University of FerraraVerified email at unife.it
- Christian WengerIHP GmbH - Leibniz institute for innovative microelectronicsVerified email at ihp-microelectronics.com
- Etienne NowakCEA-LetiVerified email at cea.fr
- elisa vianelloScientist, CEA LetiVerified email at cea.fr
- Valeriy StikanovNational Techincal University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”Verified email at kpi.ua
- Thomas SchroederLeibniz-Institut für Kristallzüchtung (IKZ); Professor in Physics at Humboldt Universität zu BerlinVerified email at ikz-berlin.de
- Enrique MirandaUniversitat Autonoma de BarcelonaVerified email at uab.cat
- Tony WuMeta, Inc.Verified email at meta.com
- Binh LeSan Jose State UniversityVerified email at sjsu.edu
- Jean-Philippe NoelResearch engineerVerified email at cea.fr
- Rolf KraemerProfessor für Informatik, Technische Universität CottbusVerified email at ihp-microelectronics.com
- Khalil gabriel El hajjam, PhDR&D process integration engineer, MicronVerified email at micron.com
- Mary WoottersStanford UniversityVerified email at stanford.edu
- Mohamed M. Sabry AlyAssociate Professor, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Thilo WernerIDLab (Ghent University - imec)Verified email at ugent.be
- Jordi SuñéProfessor, IEEE Fellow, Universitat Autònoma de BarcelonaVerified email at uab.cat
- H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Lorenzo ZuoloVerified email at unife.it
- Jaroslaw DabrowskiIHPVerified email at ihp-microelectronics.com
- Felice CrupiDIMES, Università della CalabriaVerified email at unical.it