| Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs D Farley, Y Zhou, F Askari, M Al-Bassyiouni, A Dasgupta, JFJ Caers, ... EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 17 | 2009 |
| Mechanics of adhesively bonded flip-chip-on-flex assemblies. Part II: effect of bump coplanarity on manufacturability and durability of non-conducting adhesive assemblies D Farley, A Dasgupta, JFJ Caers Journal of adhesion science and technology 22 (14), 1757-1780, 2008 | 12 | 2008 |
| Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects J Haase, D Farley, P Iyer, P Baumgartner, A Dasgupta, JFJ Caers Journal of adhesion science and technology 22 (14), 1733-1756, 2008 | 8 | 2008 |
| Qualification of a system-in-package (SiP): a physics-of-failure (PoF) perspective D Farley, A Dasgupta, J Caers ASME International Mechanical Engineering Congress and Exposition 47691, 321-327, 2006 | 5 | 2006 |
| Fatigue model based on average cross-section strain of Cu trace cyclic bending D Farley, A Dasgupta, Y Zhou, JFJ Caers, JWC De Vries 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 4 | 2011 |
| Qualification of SiP products: quasi-static cyclic mechanical bending D Farley, Y Zhou, A Dasgupta, JFJ Caers, JWC De Vries ASME International Mechanical Engineering Congress and Exposition 42991, 451-458, 2007 | 4 | 2007 |
| Characterizing non-conductive adhesives using finite element analysis: Residual stress determination D Farley, A Dasgupta, J Caers Society of Experimental Mechanics Annual Conference & Exposition, 2005 | 4 | 2005 |
| An adaptive Cu trace fatigue model based on average cross-section strain D Farley, Y Zhou, A Dasgupta, JWC DeVries Microelectronics Reliability 52 (11), 2763-2772, 2012 | 3 | 2012 |
| Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects K Sinha, D Farley, T Kahnert, SD Solares, A Dasgupta, JFJ Caers, ... Journal of Adhesion Science and Technology 28 (12), 1167-1191, 2014 | 2 | 2014 |
| Au-Au ‘cold-weld’bond strength in adhesively bonded flip-chip interconnects K Sinha, D Farley, T Kahnert, A Dasgupta, JFJ Caers, XJ Zhao 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 2 | 2011 |
| Development of fatigue models for copper traces on printed wiring assemblies under quasi-static cyclic mechanical bending DM Farley University of Maryland, College Park, 2010 | 2 | 2010 |
| Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects D Farley, T Kahnert, K Sinha, S Solares, A Dasgupta, JFJ Caers, XJ Zhao 2009 59th Electronic Components and Technology Conference, 67-73, 2009 | 2 | 2009 |
| Characterization of non-conductive adhesives D Farley, A Dasgupta, J Caers International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005 | 1 | 2005 |
| Characterization of Anisotropic Conductive Adhesives A Dasgupta, J Caers, P Iyer, P Baumgaertner, D Farley ASME International Mechanical Engineering Congress and Exposition 37149, 19-26, 2003 | 1 | 2003 |
| Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module DM Farley, F Boschman, JE Bullema, AWJ Gielen, P Hesen, ... Thermal, Mechanical and Multi-Physics Simulation and Experiments in …, 2012 | | 2012 |
| System-Level Reliability Qualification of Complex Electronic Systems D Farley, A Dasgupta, M Al-Bassyiouni, JWC de Vries ASME International Mechanical Engineering Congress and Exposition 43789, 231-237, 2009 | | 2009 |
| Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects K Sinha, D Farley, T Kahnert, S Solares, A Dasgupta, JFJ Caers, XJ Zhao ASME International Mechanical Engineering Congress and Exposition 43789, 29-34, 2009 | | 2009 |
Abhijit DasguptaProfessor of Mechanical Engineering, University of MarylandVerified email at umd.edu
