| Durability of Pb‐free solder between copper interconnect and silicon in photovoltaic cells G Cuddalorepatta, A Dasgupta, S Sealing, J Moyer, T Tolliver, J Loman Progress in photovoltaics: research and applications 18 (3), 168-182, 2010 | 66 | 2010 |
| Viscoplastic creep response and microstructure of As-fabricated microscale Sn-3.0 Ag-0.5 Cu solder interconnects G Cuddalorepatta, M Williams, A Dasgupta Journal of electronic materials 39, 2292-2309, 2010 | 55 | 2010 |
| Multi-scale modeling of the viscoplastic response of As-fabricated microscale Pb-free Sn3. 0Ag0. 5Cu solder interconnects G Cuddalorepatta, A Dasgupta Acta Materialia 58 (18), 5989-6001, 2010 | 40 | 2010 |
| In-situ X-ray diffraction combined with scanning AC nanocalorimetry applied to a Fe0. 84Ni0. 16 thin-film sample JM Gregoire, K Xiao, PJ McCluskey, D Dale, G Cuddalorepatta, ... Applied physics letters 102 (20), 2013 | 35 | 2013 |
| Effect of cyclic fatigue damage accumulation on the elastic-plastic properties of SAC305 solders G Cuddalorepatta, A Dasgupta EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 19 | 2009 |
| Creep and stress relaxation of hypo-eutectic Sn3. 0Ag0. 5Cu Pb-free alloy: testing and modeling G Cuddalorepatta, A Dasgupta ASME International Mechanical Engineering Congress and Exposition, 1-9, 2007 | 18 | 2007 |
| Stress relaxation characterization of hypoeutectic Sn3. 0Ag0. 5Cu Pb-free solder: Experiment and modeling G Cuddalorepatta, D Herkommer, A Dasgupta 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 18 | 2007 |
| Dynamic recrystallization of Sn3. 0Ag0. 5Cu Pb-free solder alloy K Holdermann, G Cuddalorepatta, A Dasgupta ASME International Mechanical Engineering Congress and Exposition 48678, 163-169, 2008 | 17 | 2008 |
| Effect of primary creep behavior on fatigue damage accumulation rates in accelerated thermal cycling of Sn3. 0Ag0. 5Cu Pb-free interconnects G Cuddalorepatta, A Dasgupta EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 13 | 2008 |
| Evolution of the microstructure and viscoplastic behavior of microscale SAC305 solder joints as a function of mechanical fatigue damage G Cuddalorepatta University of Maryland, College Park, 2010 | 11 | 2010 |
| Viscoplastic behavior of hypo-eutectic Sn3. 0Ag0. 5Cu Pb-free alloy under creep loading conditions G Cuddalorepatta, A Dasgupta ASME International Mechanical Engineering Congress and Exposition 42991, 159-167, 2007 | 11 | 2007 |
| Poisson’s ratio and residual strain of freestanding ultra-thin films GK Cuddalorepatta, WM van Rees, L Han, D Pantuso, L Mahadevan, ... Journal of the Mechanics and Physics of Solids 137, 103821, 2020 | 10 | 2020 |
| The connection between microstructural damage modeling and continuum damage modeling for eutectic Sn-Pb solder alloys P Sharma, A Dasgupta ASME International Mechanical Engineering Congress and Exposition 36274, 79-88, 2002 | 10 | 2002 |
| Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain GK Cuddalorepatta, GD Sim, H Li, D Pantuso, JJ Vlassak Journal of Materials Research 34 (20), 3474-3482, 2019 | 9 | 2019 |
| Optimization of dwell time for accelerated thermal cycling of Sn3. 0Ag0. 5Cu Pb-free interconnects G Cuddalorepatta, A Dasgupta Proc. IISc Centenary-Int. Conf. Adv. Mech. Eng, 2007 | 8 | 2007 |
| Isothermal Mechanical Durability of Hypoeutectic Sn3. 0Ag0. 5Cu G Cuddalorepatta ASME IMECE Proceedings, 2005 | 8 | 2005 |
| Cyclic mechanical durability of Sn3. 0Ag0. 5Cu Pb-free solder alloy G Cuddalorepatta, A Dasgupta ASME International Mechanical Engineering Congress and Exposition 42177, 331-337, 2005 | 8 | 2005 |
| Measurement of the stress-strain behavior of freestanding ultra-thin films GK Cuddalorepatta, H Li, D Pantuso, JJ Vlassak Materialia 9, 100502, 2020 | 5 | 2020 |
| Multi-scale viscoplastic modeling of Pb-free Sn3. 0Ag0. 5Cu solder interconnects G Cuddalorepatta, A Dasgupta 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010 | | 2010 |
| Effect of Cyclic Damage on the Constitutive Behavior & Microstructure of Sn3. 0Ag0. 5Cu (SAC305) Solder G Cuddalorepatta, A Dasgupta MRS Online Proceedings Library (OPL) 1158, 1158-F02-03, 2009 | | 2009 |
