| Die attach materials for high temperature applications: A review VR Manikam, KY Cheong IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011 | 540 | 2011 |
| Chemical reduction methods for synthesizing Ag and Al nanoparticles and their respective nanoalloys VR Manikam, KY Cheong, KA Razak Materials Science and Engineering: B 176 (3), 187-203, 2011 | 90 | 2011 |
| Sintering of silver–aluminum nanopaste with varying aluminum weight percent for use as a high-temperature die-attach material VR Manikam, KA Razak, KY Cheong IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 39 | 2012 |
| Reliability of sintered Ag80–Al20 die attach nanopaste for high temperature applications on SiC power devices VR Manikam, KA Razak, KY Cheong Microelectronics Reliability 53 (3), 473-480, 2013 | 27 | 2013 |
| Physical and electrical attributes of sintered Ag80–Al20 high temperature die attach material with different organic additives content VR Manikam, KA Razak, KY Cheong Journal of Materials Science: Materials in Electronics 24, 720-733, 2013 | 13 | 2013 |
| A novel silver–aluminium high-temperature die attach nanopaste system: the effects of organic additives content on post-sintered attributes VR Manikam, KA Razak, KY Cheong Journal of Materials Science: Materials in Electronics 24, 2678-2688, 2013 | 11 | 2013 |
| Sintering of Ag paste for power devices die attach on Cu surfaces VR Manikam, EN Tolentino 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 94-98, 2014 | 10 | 2014 |
| Effects of soft solder materials and die attach process parameters on large power semiconductor dies joint reliability VR Manikam, S Paing, A Ang 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 152-155, 2013 | 10 | 2013 |
| Direct bonded copper semiconductor packages and related methods EN Tolentino, VR Manikam, A Aripin US Patent 9,659,837, 2017 | 7 | 2017 |
| The improvements of high temperature Zn-based lead free solder X Wu, J Li, T Unuvar, VR Manikam, EN Tolentino 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1268-1272, 2015 | 4 | 2015 |
| Semiconductor package with protective tape TL Wong, BY Low, VR Manikam, VR Manikam US Patent 8,237,293, 2012 | 4 | 2012 |
| Components, Packag VR Manikam, KY Cheong Manuf. Technol. IEEE Trans 1 (4), 457-478, 2011 | 4 | 2011 |
| Direct bonded copper semiconductor packages and related methods EN Tolentino, VR Manikam, A Aripin US Patent 10,546,798, 2020 | 3 | 2020 |
| Process control of sintered ag joint in production for die attach applications KS Siow, VR Manikam, ST Chua Die-Attach Materials for High Temperature Applications in Microelectronics …, 2019 | 3 | 2019 |
| Method and apparatus for molding substrate VR Manikam, BY Low, VR Manikam US Patent 8,062,424, 2011 | 3 | 2011 |
| Improving reliability for electronic power modules VR Manikam, EN Tolentino, FN Ramuhzan, NM Tajuddin, A Aripin 36th International Electronics Manufacturing Technology Conference, 1-5, 2014 | 2 | 2014 |
| Sintering of Ag80-Al20nanoalloy for high temperature die attach applications on silicon carbide-based power devices: The effects of ramp rate and dwell time VR Manikam, KA Razak, KY Cheong 2012 35th IEEE/CPMT International Electronics Manufacturing Technology …, 2012 | 2 | 2012 |
| Direct bonded copper semiconductor packages and related methods EN Tolentino, VR Manikam, A Aripin US Patent 9,991,185, 2018 | 1 | 2018 |
| Effect of Sintering Time on Silver-Aluminium Nanopaste for High Temperature Die Attach Applications VR Manikam, AR Khairunisak, KY Cheong Advanced Materials Research 576, 199-202, 2012 | 1 | 2012 |
| Direct bonded copper semiconductor packages and related methods EN Tolentino, VR Manikam, A Aripin US Patent App. 16/773,436, 2020 | | 2020 |
Khairunisak Abdul RazakProfessor, Universiti Sains MalaysiaVerified email at usm.my
