| The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5 Cu solder alloy MH Mahdavifard, MFM Sabri, DA Shnawah, SM Said, IA Badruddin, ... Microelectronics Reliability 55 (9-10), 1886-1890, 2015 | 59 | 2015 |
| High stability and aging resistance Sn-1Ag-0.5 Cu solder alloy by Fe and Bi minor alloying MH Mahdavifard, MFM Sabri, SM Said, S Rozali Microelectronic Engineering 208, 29-38, 2019 | 23 | 2019 |
| Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7 Cu solder alloy HA Jaffery, MFM Sabri, S Rozali, MH Mahdavifard, DA Shnawah RSC advances 6 (63), 58010-58019, 2016 | 20 | 2016 |
| Effects of Fe and Bi minor alloying on mechanical, thermal, and microstructural properties of Sn-0.7 Cu solder alloy MH Mahdavifard, MFM Sabri, SM Said, DA Shnawah, IA Badruddin, ... Journal of Electronic Materials 45, 3673-3682, 2016 | 17 | 2016 |
| Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5 Cu solder alloy under high temperature environment B Ali, MFM Sabri, SM Said, NL Sukiman, I Jauhari, MH Mahdavifard Microelectronics Reliability 82, 171-178, 2018 | 13 | 2018 |
| Microstructural modification of Sn-0.7 Cu solder alloys by Fe/Bi-addition for achieving high mechanical performance B Ali, MFM Sabri, SM Said, MH Mahdavifard, NL Sukiman, I Jauhari Journal of Electronic Materials 46, 4755-4764, 2017 | 9 | 2017 |
| Oxidation and wetting characteristics of lead-free Sn-0.7 Cu solder alloys with the addition of Fe and Bi SHA Jaffery, MFM Sabri, S Rozali, SW Hasan, MH Mahdavifard, ... Microelectronics Reliability 139, 114802, 2022 | 8 | 2022 |
| Interfacial reactions between Cu substrate and Sn–1Ag–0.5 Cu solder containing 0.1 wt% Al by dipping method DA Shnawah, MFM Sabri, SBM Said, I Jauhari, MH Mahdavifard, ... Journal of Materials Science: Materials in Electronics 26, 8229-8239, 2015 | 3 | 2015 |
| Properties of Sn0. 7Cu solder alloys bearing Fe and Bi MFM Sabri, MFM Salleh, SHA Jaffery, MH Mahdavifard Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | 1 | 2022 |
| Investigation on Mechanical, Microstructural and Thermal Properties of Sn-0.7 cu and Sn-1ag 0.5 cu Solder Alloys Bearing Fe and Bi MH Mahdavifard PQDT-Global, 2017 | | 2017 |
| Effects of Molybdenum Nanoparticles on the Interface Between Lead-Free Solder and Nickel Substrate MH Mahdavifard PQDT-Global, 2013 | | 2013 |
| Reflow of Sn-3.8 Ag-0.7Cu solder on Ni substrate in presence of Mo nanoparticles MH Mahdavifard, A Haseeb, MM Arafat 1st International Conference on the Science & Engineering of Materials …, 2013 | | 2013 |
| EFFECT OF AGING ON MECHANICAL PROPERTIES OF Sn-Cu-Fe-Bi SOLDER ALLOY MHMU Malaya, MFMSU Malaya, SMSU Malaya, IABU Malaya, ... | | |
