| Emerging challenges of microactuators for nanoscale positioning, assembly, and manipulation B Sahu, CR Taylor, KK Leang | 69 | 2010 |
| Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets SA Ferguson, B Sahu, R Aoki, T Boyd, EW Buddrius, K Ceurter, ... US Patent 11,291,115, 2022 | 14 | 2022 |
| Design and fabrication of an automatic nanoscale tool-tip exchanger for scanning probe microscopy B Sahu, CR Taylor, RO Riddle, KK Leang International Manufacturing Science and Engineering Conference 44311, 493-506, 2011 | 10 | 2011 |
| Technologies for sealed liquid cooling system DP Kulkarni, MDLLB Velazquez, AR Macias, S Ahuja, S Tejas, B Sahu US Patent App. 17/359,342, 2021 | 6 | 2021 |
| Bonded silicon structure for high density print head PJ Nystrom, B Sahu US Patent 8,727,508, 2014 | 6 | 2014 |
| Liquid cooling system leak detection improvements P Subrahmanyam, Y Xia, P Ying-Feng, V Polyanko, M Bianco, B Sahu, ... US Patent App. 17/133,554, 2022 | 5 | 2022 |
| Design and analysis of scanning probe microscopy cantilevers with microthermal actuation B Sahu, RO Riddle, D Ross, M Sheplak, KK Leang, CR Taylor Journal of Microelectromechanical Systems 24 (6), 1768-1781, 2015 | 3 | 2015 |
| Laser transmission laminating of materials for ink jet printheads PJ Nystrom, MA Cellura, B Sahu US Patent 8,931,879, 2015 | 3 | 2015 |
| Mechanical seal and reservoir for microelectronic packages B Sahu, TA Boyd, JL Smalley US Patent 10,418,309, 2019 | 2 | 2019 |
| Printhead with nanotips for nanoscale printing and manufacturing PJ Nystrom, AW Hays, B Sahu US Patent 9,038,269, 2015 | 1 | 2015 |
| Liquid metal interconnect for modular system on an interposer server architecture K Meyyappan, G Murtagian, S Nekkanty, P Tadayon, EJM Moret, B Sahu US Patent App. 17/559,431, 2023 | | 2023 |
| Microelectronic assemblies having dies with backside back-end-of-line heater traces B Sahu, T Acikalin, A Haridass, V Thigle US Patent App. 17/356,239, 2022 | | 2022 |
| Scalable debris-free socket loading mechanism A Larson, B Sahu, CJ Jahne, EW Buddrius, RV Miele US Patent 11,387,163, 2022 | | 2022 |
| Flexible and modular top and bottom side processor unit module cooling AR Macias, AB Athalye, DP Kulkarni, GR Paredes, B Sahu US Patent App. 17/187,164, 2021 | | 2021 |
| Modular thermal energy management designs for data center computing M Le, T Boyd, B Sahu, E Chenelly, CW Ackerman, CA Flores, C Jahne US Patent 11,032,941, 2021 | | 2021 |
| Variable conductance heat pipes for improved reliability DP Kulkarni, B Sahu US Patent App. 17/130,906, 2021 | | 2021 |
| Printhead with nanotips for nanoscale printing and manufacturing PJ Nystrom, AW Hays, B Sahu US Patent 9,889,653, 2018 | | 2018 |
| Ultrasonic laminating of materials for ink jet printheads PJ Nystrom, MA Cellura, B Sahu US Patent 8,919,915, 2014 | | 2014 |
| Design, fabrication, and characterization of a scanning probe microscopy cantilever with an integrated electrothermally actuated microgripper for automated tool-tip exchange B Sahu University of Florida, 2013 | | 2013 |
Curtis R. Taylor, Ph.D.University of FloridaVerified email at ufl.edu
Curtis R. Taylor, Ph.D.University of FloridaVerified email at ufl.edu