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Madhavan Swaminathan
Madhavan Swaminathan
Dept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn State
Verified email at psu.edu - Homepage
Title
Cited by
Cited by
Year
Power integrity modeling and design for semiconductors and systems
M Swaminathan, E Engin
Pearson Education, 2007
4732007
Power distribution networks for system-on-package: Status and challenges
M Swaminathan, J Kim, I Novak, JP Libous
IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004
3342004
Introduction to System on Package (SOP).
R Tummala, M Swaminathan
McGraw-Hill Professional Publishing, 2007
2252007
Impact of power-supply noise on timing in high-frequency microprocessors
M Saint-Laurent, M Swaminathan
IEEE Transactions on Advanced Packaging 27 (1), 135-144, 2004
2102004
Method for fabricating three-dimensional all organic interconnect structures
GE White, M Swaminathan, V Sundaram, S Dalmia
US Patent 7,805,834, 2010
2002010
Modeling and transient simulation of planes in electronic packages
N Na, J Choi, S Chun, M Swaminathan, J Srinivasan
IEEE Transactions on Advanced Packaging 23 (3), 340-352, 2000
1942000
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
1862004
Modeling of irregular shaped power distribution planes using transmission matrix method
JH Kim, M Swaminathan
IEEE Transactions on advanced packaging 24 (3), 334-346, 2001
1862001
A novel integrated decoupling capacitor for MCM-L technology
P Chahal, RR Tummala, MG Allen, M Swaminathan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1611998
Designing and modeling for power integrity
M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie
IEEE Transactions on Electromagnetic Compatibility 52 (2), 288-310, 2010
1602010
Modeling of simultaneous switching noise in high speed systems
S Chun, M Swaminathan, LD Smith, J Srinivasan, Z Jin, MK Iyer
IEEE Transactions on Advanced Packaging 24 (2), 132-142, 2001
1522001
Electrical modeling of through silicon and package vias
T Bandyopadhyay, R Chatterjee, D Chung, M Swaminathan, R Tummala
2009 IEEE International Conference on 3D System Integration, 1-8, 2009
1472009
High density memory structure
MF McAllister, JA McDonald, GJ Robbins, M Swaminathan, GM Wilkins
US Patent 5,523,619, 1996
1411996
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
KJ Han, M Swaminathan, T Bandyopadhyay
IEEE Transactions on Advanced Packaging 33 (4), 804-817, 2010
1272010
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011
1192011
A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications
J Choi, V Govind, M Swaminathan
Proceedings. 2004 IEEE Radio and Wireless Conference (IEEE Cat. No. 04TH8746 …, 2004
1182004
Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation
M Swaminathan, E Arvas, TK Sarkar, AR Djordjevic
IEEE transactions on microwave theory and techniques 38 (2), 154-159, 1990
1181990
High-dimensional global optimization method for high-frequency electronic design
HM Torun, M Swaminathan
IEEE Transactions on Microwave Theory and Techniques 67 (6), 2128-2142, 2019
1142019
A global Bayesian optimization algorithm and its application to integrated system design
HM Torun, M Swaminathan, AK Davis, MLF Bellaredj
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (4), 792-802, 2018
1142018
Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects
J Xie, M Swaminathan
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011
1132011
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