| Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate EEM Noor, NM Sharif, CK Yew, T Ariga, AB Ismail, Z Hussain Journal of Alloys and Compounds 507 (1), 290-296, 2010 | 82 | 2010 |
| Recycling of Malaysia’s electric arc furnace (EAF) slag waste into heavy-duty green ceramic tile PT Teo, AS Anasyida, P Basu, MS Nurulakmal Waste Management 34 (12), 2697-2708, 2014 | 75 | 2014 |
| Effect of iron and indium on IMC formation and mechanical properties of lead-free solder H Fallahi, MS Nurulakmal, AF Arezodar, J Abdullah Materials Science and Engineering: A 553, 22-31, 2012 | 63 | 2012 |
| Recycling of Malaysia's EAF steel slag waste as novel fluxing agent in green ceramic tile production: Sintering mechanism and leaching assessment P Ter Teo, AS Anasyida, CM Kho, MS Nurulakmal Journal of cleaner production 241, 118144, 2019 | 41 | 2019 |
| Effect of Al addition to bulk microstructure, IMC formation, wetting and mechanical properties of low-Ag SAC solder K Maslinda, AS Anasyida, MS Nurulakmal Journal of Materials Science: Materials in Electronics 27, 489-502, 2016 | 34 | 2016 |
| Study on Coarsening of Ag3Sn Intermetallic Coumpound in the Fe-modified Sn-1Ag-0.5Cu Solder Alloys MHE Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin ... Journal of Alloys and Compounds 622, 184-188, 2015 | 34 | 2015 |
| Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test NAFNMANNSI N.I.M. Nordin, S.M. Said, R. Ramli, M.F.M. Sabri, N.M. Sharif Microelectronics Reliability 54, 2044 - 2047, 2014 | 19 | 2014 |
| Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test H Fallahi, MS Nurulakmal, A Fallahi, J Abdullah Journal of Materials Science: Materials in Electronics 23, 1739-1749, 2012 | 15 | 2012 |
| Effect of In addition on microstructure, wettability and strength of SnCu solder A Nabihah, MS Nurulakmal Materials Today: Proceedings 17, 803-809, 2019 | 14 | 2019 |
| Characteristic of low temperature of Bi-In-Sn solder alloy EEM Noor, AB Ismail, NM Sharif, T Ariga, Z Hussain 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology …, 2008 | 12 | 2008 |
| Surface roughness, wear and thermal conductivity of ternary electroless Ni–Ag–P coating on copper substrate N Ariffah, MS Nurulakmal, AS Anasyida, EK Shiu Materials Research Express 7 (2), 026536, 2020 | 10 | 2020 |
| Characterization of ceramic tiles added with EAF slag waste PT Teo, AS Anasyida, MS Nurulakmal Advanced Materials Research 1024, 211-214, 2014 | 10 | 2014 |
| Effect of complexing agent in Ni-P coating on Cu substrate MS Nur Ariffah, N Mohd Sharif, AS Anasyida, EK Shiu Materials Science Forum 819, 97-102, 2015 | 8 | 2015 |
| The effect of space holder content and decomposition methods in fabrication of aluminum foams by powder metallurgy method using carbamide space holder AH Amirah, MS Nurulakmal, AS Anasyida AIP Conference Proceedings 1756 (1), 2016 | 6 | 2016 |
| Crystallization of potassium calcium silicate from modified industrial EAF slag KB Lateef, SARS Abdul Hamid, MS Nurulakmal Advanced Materials Research 620, 66-71, 2013 | 6 | 2013 |
| A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor M Selvan, MSA Aziz, KH Yu, MS Nurulakmal, HP Ong, CY Khor International Journal of Thermal Sciences 184, 107938, 2023 | 5 | 2023 |
| Numerical study on the effect of fin length variation on the thermal performance of a bus duct conductor M Selvan, MSA Aziz, MS Nurulakmal, HP Ong, CY Khor Numerical Heat Transfer, Part A: Applications 83 (2), 116-133, 2023 | 5 | 2023 |
| Evaluation of the leaching behavior of hexavalent chromium from Malaysian electric arc furnace steel slag KB Lateef, AR Sheikh, MS Nurulakmal, N Baharun Advanced Materials Research 652, 1628-1632, 2013 | 5 | 2013 |
| Assessment of EAF steel slag solubility by statistical design KB Lateef, SA Rezan, MS Nurulakmal Advanced Materials Research 858, 228-235, 2014 | 4 | 2014 |
| Effect of aluminium and silicon to IMC formation in low Ag-SAC solder M Kamarudin, AS Anasyida, N Mohd Sharif Materials Science Forum 819, 63-67, 2015 | 3 | 2015 |
