| Impression creep behavior of lead-free Sn–5Sb solder alloy R Mahmudi, AR Geranmayeh, A Rezaee-Bazzaz Materials Science and Engineering: A 448 (1-2), 287-293, 2007 | 97 | 2007 |
| Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys R Mahmudi, AR Geranmayeh, H Khanbareh, N Jahangiri Materials & Design 30 (3), 574-580, 2009 | 85 | 2009 |
| High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder AR Geranmayeh, R Mahmudi, M Kangooie Materials Science and Engineering: A 528 (12), 3967-3972, 2011 | 73 | 2011 |
| Indentation creep study of lead-free Sn–5% Sb solder alloy R Mahmudi, AR Geranmayeh, M Bakherad, M Allami Materials Science and Engineering: A 457 (1-2), 173-179, 2007 | 70 | 2007 |
| Interlaminar shear strength and tensile properties of environmentally-friendly fiber metal laminates reinforced by hybrid basalt and jute fibers N Zareei, A Geranmayeh, R Eslami-Farsani Polymer Testing 75, 205-212, 2019 | 64 | 2019 |
| Room-temperature indentation creep of lead-free Sn–Bi solder alloys R Mahmudi, AR Geranmayeh, SR Mahmoodi, A Khalatbari Journal of Materials Science: Materials in Electronics 18, 1071-1078, 2007 | 64 | 2007 |
| Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag AR Geranmayeh, G Nayyeri, R Mahmudi Materials Science and Engineering: A 547, 110-119, 2012 | 63 | 2012 |
| Impression creep behavior of cast Pb–Sb alloys R Mahmudi, AR Geranmayeh, A Rezaee-Bazzaz Journal of alloys and compounds 427 (1-2), 124-129, 2007 | 58 | 2007 |
| Power law indentation creep of Sn-5% Sb solder alloy AR Geranmayeh, R Mahmudi Journal of materials science 40, 3361-3366, 2005 | 55 | 2005 |
| Impression creep of hypoeutectic Sn–Zn lead-free solder alloys R Mahmudi, AR Geranmayeh, H Noori, M Shahabi Materials Science and Engineering: A 491 (1-2), 110-116, 2008 | 54 | 2008 |
| Room-temperature indentation creep of lead-free Sn-5% Sb solder alloy AR Geranmayeh, R Mahmudi Journal of electronic materials 34, 1002-1009, 2005 | 48 | 2005 |
| Effect of Li content on the indentation creep characteristics of cast Mg–Li–Zn alloys R Mahmudi, M Shalbafi, M Karami, AR Geranmayeh Materials & Design 75, 184-190, 2015 | 44 | 2015 |
| Effect of cooling rate on the room-temperature impression: creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders R Mahmudi, AR Geranmayeh, H Noori, N Jahangiri, H Khanbareh Materials Science and Engineering: A 487 (1-2), 20-25, 2008 | 43 | 2008 |
| Enhanced superplasticity in equal-channel angularly pressed Sn–5Sb alloy R Mahmudi, R Alizadeh, AR Geranmayeh Scripta Materialia 64 (6), 521-524, 2011 | 42 | 2011 |
| A comparative study on the effects of Gd, Y and La rare-earth elements on the microstructure and creep behavior of AZ81 Mg alloy SM Ashrafizadeh, R Mahmudi, AR Geranmayeh Materials Science and Engineering: A 790, 139712, 2020 | 38 | 2020 |
| Impression creep study of a Cu–0.3 Cr–0.1 Ag alloy R Mahmudi, A Karsaz, A Akbari-Fakhrabadi, AR Geranmayeh Materials Science and Engineering: A 527 (10-11), 2702-2708, 2010 | 36 | 2010 |
| Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles M Kangooie, R Mahmudi, AR Geranmayeh Journal of electronic materials 39, 215-222, 2010 | 31 | 2010 |
| Compressive and impression creep behavior of a cast Mg–Al–Zn–Si alloy AR Geranmayeh, R Mahmudi Materials Chemistry and Physics 139 (1), 79-86, 2013 | 29 | 2013 |
| Indentation creep of lead-free Sn–3.5 Ag solder alloy: Effects of cooling rate and Zn/Sb addition R Mahmudi, M Pourmajidian, AR Geranmayeh, S Gorgannejad, ... Materials Science and Engineering: A 565, 236-242, 2013 | 23 | 2013 |
| Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy R Mahmudi, AR Geranmayeh, B Zahiri, MH Marvasti Journal of Materials Science: Materials in Electronics 21, 58-64, 2010 | 23 | 2010 |
Reza MahmudiProfessor of Materials Engineering, University of TehranVerified email at ut.ac.ir
