| Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering process S Chellvarajoo, MZ Abdullah, Z Samsudin Materials & Design 67, 197-208, 2015 | 76 | 2015 |
| Hardness profiles of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder by nanoindentation MZ Yahaya, FC Ani, Z Samsudin, S Sahin, MZ Abdullah, AA Mohamad Materials Science and Engineering: A 669, 178-186, 2016 | 42 | 2016 |
| Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani Microelectronics Reliability 79, 69-78, 2017 | 38 | 2017 |
| A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process FC Ng, MYT Ali, A Abas, CY Khor, Z Samsudin, MZ Abdullah The International Journal of Advanced Manufacturing Technology 105, 3521-3530, 2019 | 15 | 2019 |
| Experimental study of Self-Alignment during reflow soldering process AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani Journal of Advanced Manufacturing Technology (JAMT) 12 (1 (2)), 355-366, 2018 | 15 | 2018 |
| Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution NK Othman, KY Teng, A Jalar, F Che Ani, Z Samsudin Materials Science Forum 846, 3-12, 2016 | 11 | 2016 |
| Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process S Zulfiqar, AA Saad, MFM Sharif, Z Samsudin, MYT Ali, FC Ani, Z Ahmad, ... Microelectronics Reliability 127, 114373, 2021 | 9 | 2021 |
| Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF) C Sarveswaran, EM Salleh, A Jalar, Z Samsudin, M Ali, FC Ani, ... AIP Conference Proceedings 1838 (1), 2017 | 9 | 2017 |
| Investigation of electrochemical migration on Sn-0.7 Cu-0.3 Ag-0.03 P-0.005 Ni solder alloy in HNO3 solution C Sarveswaran, NK Othman, M Ali, FC Ani, Z Samsudin AIP Conference Proceedings 1678 (1), 2015 | 9 | 2015 |
| Mechanical durability of screen-printed flexible silver traces for wearable devices MI Suhaimi, AN Nordin, AAM Ralib, I Voiculescu, WC Mak, LL Ming, ... Sensing and Bio-Sensing Research 38, 100537, 2022 | 7 | 2022 |
| Structural and random vibration analysis of LEDs conductive polymer interconnections S Zulfiqar, AA Saad, MAW Chek, MFM Sharif, Z Samsudin, MYT Ali IOP Conference Series: Materials Science and Engineering 815 (1), 012003, 2020 | 7 | 2020 |
| Study of different dispensing patterns of No-flow underfill using numerical and experimental methods MN Nashrudin, A Abas, MZ Abdullah, MYT Ali, Z Samsudin Journal of Electronic Packaging 143 (3), 031005, 2021 | 5 | 2021 |
| No-flow underfill: effect of chip placement speed on the void formation using numerical method MN Nashrudin, A Abas, MZ Abdullah, MYT Ali, Z Samsudin, I Mansor Microelectronics Journal 114, 105139, 2021 | 5 | 2021 |
| A study on a stretchable conductive polymer of thermoplastic automotive device MFM Sharif, AA Saad, MK Abdullah, NA Aziz, NA Ismail, FC Ani, MYT Ali, ... 2018 IEEE 38th International Electronics Manufacturing Technology Conference …, 2018 | 5 | 2018 |
| Prediction of the void formation in no-flow underfill process using machine learning-based algorithm MN Nashrudin, FC Ng, A Abas, MZ Abdullah, MYT Ali, Z Samsudin Microelectronics Reliability 135, 114586, 2022 | 4 | 2022 |
| Simulation of geometrical parameters of screen printed electrode (SPE) for electrochemical-based sensor NAF Roslan, R Ab Rahim, AAM Ralib, NF Za'bah, AN Nordin, MSR Bashri, ... 2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 137-140, 2021 | 4 | 2021 |
| Screen-Printed Nickel–Zinc Batteries: A Review of Additive Manufacturing and Evaluation Methods MA Nazri, LM Lim, Z Samsudin, MYT Ali, I Mansor, MI Suhaimi, ... 3D Printing and Additive Manufacturing 8 (3), 176-192, 2021 | 4 | 2021 |
| Stress analysis of stretchable conductive polymer for electronics circuit application NA Aziz, AA Saad, Z Ahmad, S Zulfiqar, FC Ani, Z Samsudin Handbook of Materials Failure Analysis, 205-224, 2020 | 3 | 2020 |
| The morphology of Pb-free Sn–3.0 Ag–0.5 Cu solder reinforced by NiO nanoparticles FR Omar, EM Salleh, NK Othman, FC Ani, Z Samsudin AIP Conference Proceedings 2111 (1), 2019 | 3 | 2019 |
| The effect of electrochemical migration of pb-free sn-3.0 ag-0.5 cu solder reinforced by nio nanoparticles FR Omar, EM Salleh, NK Othman, FC Ani, Z Samsudin J. Mater. Sci. Eng. A 8 (5), 185-189, 2018 | 3 | 2018 |
Mohd Yusuf Tura AliSr. Engineering Services Engineer, Jabil CircuitVerified email at jabil.com
