| Rapid photoresponsive switchable pressure-sensitive adhesive containing azobenzene for the mini-light emitting diode transfer process TH Lee, GY Han, MB Yi, HJ Kim, JH Lee, S Kim ACS Applied Materials & Interfaces 13 (36), 43364-43373, 2021 | 23 | 2021 |
| Highly resilient dual-crosslinked hydrogel adhesives based on a dopamine-modified crosslinker GY Han, JY Park, TH Lee, MB Yi, HJ Kim ACS Applied Materials & Interfaces 14 (32), 36304-36314, 2022 | 22 | 2022 |
| Movable cross-linking in adhesives: superior stretching and adhesion properties via a supramolecular sliding effect MB Yi, TH Lee, GY Han, H Kim, HJ Kim, Y Kim, HS Ryou, DU Jin ACS Applied Polymer Materials 3 (5), 2678-2686, 2021 | 20 | 2021 |
| Rapidly Deformable Vitrimer Epoxy System with Supreme Stress‐Relaxation Capabilities via Coordination of Solvate Ionic Liquids JH Shin, MB Yi, TH Lee, HJ Kim Advanced Functional Materials 32 (51), 2207329, 2022 | 12 | 2022 |
| Facile preparation of a polymer-ZnO composite colloid as an electron transport layer and its effects on inverted polymer solar cells MB Yi, JR Ku, JS Yoon, J Kal, W Lee, SG Oh Journal of Physics and Chemistry of Solids 145, 109538, 2020 | 6 | 2020 |
| Photoresponsive, switchable, pressure-sensitive adhesives: influence of UV intensity and hydrocarbon chain length of low molecular weight azobenzene compounds TH Lee, GY Han, MB Yi, JH Shin, HJ Kim RSC advances 11 (59), 37392-37402, 2021 | 5 | 2021 |
| Topologically designed cross-linking network for stretchable and recoverable pressure-sensitive adhesives with exceptional softness MB Yi, TH Lee, SJ Lee, JS Kim, HJ Kim Materials Today Chemistry 26, 101141, 2022 | 2 | 2022 |
| From waste to tape: Inverse vulcanization of sulfur and solvent-based depolymerization for preparation of pressure-sensitive adhesives SJ Lee, GY Han, MB Yi, JH Back, HJ Kim Journal of Materials Research and Technology 29, 1798-1804, 2024 | | 2024 |
| Selective transfer of mini-light-emitting diodes via the laser-induced switching of adhesives based on azobenzene composites TH Lee, JH Back, JS Lim, GY Han, MB Yi, Y Kim, JH Lee, S Kim, HJ Kim Composites Part B: Engineering 272, 111175, 2024 | | 2024 |
| Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch GY Han, JY Park, JH Back, MB Yi, HJ Kim Advanced Healthcare Materials, 2303342, 2024 | | 2024 |
| Surface-patterned gallol pressure-sensitive adhesives for strong underwater adhesion SJ Lee, JH Back, JS Kim, MB Yi, GY Han, Y Do Kim, HJ Kim Materials & Design 236, 112505, 2023 | | 2023 |
| Rapid cure composites in electronics industry JH Shin, MB Yi, SJ Lee, HJ Kim Rapid Cure Composites, 179-212, 2023 | | 2023 |
Gi-Yeon HanSeoul National UniversityVerified email at snu.ac.kr
