Origin and quantification of increased core loss in MnZn ferrite plates of a multi-gap inductor D Neumayr, D Bortis, JW Kolar, S Hoffmann, E Hoene CPSS Transactions on Power Electronics and Applications 4 (1), 72-93, 2019 | 24 | 2019 |
Advances in automotive interior lighting concerning new LED approach and optical performance K Blankenbach, F Hertlein, S Hoffmann Journal of the Society for Information Display 28 (8), 655-667, 2020 | 18 | 2020 |
Analysis of security features in DLMS/COSEM: Vulnerabilities and countermeasures N Luring, D Szameitat, S Hoffmann, G Bumiller 2018 IEEE Power & Energy Society Innovative Smart Grid Technologies …, 2018 | 12 | 2018 |
Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter T Masuzawa, E Hoene, S Hoffmann, KD Lang 2014 International Power Electronics Conference (IPEC-Hiroshima 2014-ECCE …, 2014 | 12 | 2014 |
Reducing inductor size in high frequency grid feeding inverters S Hoffmann, E Hoene, O Zeiter, KD Lang, G Feix Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015 | 11 | 2015 |
Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors A Kuczmik, S Hoffmann, E Hoene CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 8 | 2020 |
Modeling method of stray magnetic couplings in an EMC filter for power electronic devices T Masuzawa, E Hoene, S Hoffmann, KD Lang IEEJ Journal of Industry Applications 4 (6), 738-744, 2015 | 8 | 2015 |
Integrating volunteers into rescue processes: analysis of user requirements and mobile app conception H Detjen, S Hoffmann, L Rösner, S Winter, S Geisler, N Krämer, ... International Journal of Information Systems for Crisis Response and …, 2015 | 8 | 2015 |
New security features in DLMS/COSEM—A comparison to the smart meter gateway SG Hoffmann, R Massink, G Bumiller 2015 IEEE Innovative Smart Grid Technologies-Asia (ISGT ASIA), 1-6, 2015 | 7 | 2015 |
Effective method for filter design and semiconductor and inductors loss calculation S Hoffmann, E Hoene, O Zeiter, A Kuczmik, KD Lang 2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016 | 6 | 2016 |
Layer-2 security for PLC-a comparison between ITU-T G. 9903 and IEEE 1901.2 SG Hoffmann 2016 International Symposium on Power Line Communications and its …, 2016 | 6 | 2016 |
System Simulation of Automotive High Voltage Grids: Modelling of Power Converters and Connecting Cables S Schoerle, E Hoene, S Hoffmann, A Kuczmik, KD Lang 2014 IEEE Vehicle Power and Propulsion Conference (VPPC), 1-6, 2014 | 5 | 2014 |
Electrical, thermal and electromagnetic design of a SiC solar inverter: a case study S Hoffmann, E Hoene, O Zeiter PCIM Europe 2013, 470-477, 2013 | 5 | 2013 |
A New Filter Concept for High Pulse-Frequency 3-Phase AFE Motor Drives S Hoffmann, M Bock, E Hoene Energies 14 (10), 2814, 2021 | 4 | 2021 |
Deep voxel-guided morphometry (vgm): learning regional brain changes in serial mri AK Schnurr, P Eisele, C Rossmanith, S Hoffmann, J Gregori, ... Machine Learning in Clinical Neuroimaging and Radiogenomics in Neuro …, 2020 | 4 | 2020 |
14‐1: Invited Paper: Advances in Automotive Interior Lighting K Blankenbach, F Hertlein, S Hoffmann SID Symposium Digest of Technical Papers 50 (1), 176-179, 2019 | 4 | 2019 |
Ferrite embedding for Power SiPs-a packaging view T Thomas, M Schneider-Ramelow, S Hoffmann, KF Becker, H Walter, ... CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 4 | 2018 |
Feasibility of fully automated atrophy measurement of the upper cervical spinal cord for group analyses and patientindividual diagnosis support in MS J Gregori, C Cornelissen, S Hoffmann, M Treiber, S Randoll, S Heldmann, ... MULTIPLE SCLEROSIS JOURNAL 24, 623-624, 2018 | 3 | 2018 |
Packaging Platform for low to medium Power Packages T Thomas, TD Nguyen, M Blechert, S Hoffmann, M Obst, KF Becker, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 39-44, 2022 | 2 | 2022 |
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging T Thomas, M van Dijk, M Dreissigacker, S Hoffmann, H Walter, KF Becker, ... Journal of Microelectronics and Electronic Packaging 17 (2), 35-44, 2020 | 2 | 2020 |