| Enhancing electrocatalytic total water splitting at few layer Pt-NiFe layered double hydroxide interfaces S Anantharaj, K Karthick, M Venkatesh, TVSV Simha, AS Salunke, L Ma, ... Nano Energy 39, 30-43, 2017 | 255 | 2017 |
| High-performance oxygen evolution anode from stainless steel via controlled surface oxidation and Cr removal S Anantharaj, M Venkatesh, AS Salunke, TVSV Simha, V Prabu, S Kundu ACS Sustainable Chemistry & Engineering 5 (11), 10072-10083, 2017 | 92 | 2017 |
| Free-Standing Graphene/Conducting Polymer HybridCathodes as FTO and Pt-Free Electrode for Quasi-State DyeSensitized Solar Cells DSM Karthick Ramalingam, SarojiniJeeva Panchu, Ashish Shivaji Salunke ... Chemistry Select 1 (Issue 15), Pages 4814–4822, 2016 | 16* | 2016 |
| Mechanistic Study of Copper Wire-bonding Failures on Packaging Devices in Acidic Chloride Environments OMC Nick Ross, Muthappan Asokan, Goutham Issac Ashok Kumar, Joshua Caperton ... Microelectronic Reliability 113 (113917), 2020 | 15 | 2020 |
| Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application GIA Kumar, J Alptekin, J Caperton, A Salunke, O Chyan MethodsX 8, 101320, 2021 | 6 | 2021 |
| Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability AS Salunke, J Alptekin, K Akula, S Jayakumar, S Kumar, O Chyan Journal of Microelectronics and Electronic Packaging 20 (1), 17-26, 2023 | | 2023 |
| Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability OC Ashish S. Salunke,* John Alptekin, Kaushik Akula, Subiksha Jayakumar ... Journal of Microelectronics and Electronic Packaging 20 (1), 10, 2023 | | 2023 |
| Spectroscopic Investigation of Complex Redox Equilibria in Cupric Chloride Subtractive Etching for Cu High Density Interconnects G Issac, A Lambert, J Caperton, A Salunke, L Lu, O Chyan Electrochemical Society Meeting Abstracts 235, 2166-2166, 2019 | | 2019 |
| Development of a New Copper Corrosion Screening Methodology for Application in Microelectronics J Alptekin, AS Salunke, M Asokan, G Issac, J Caperton, O Chyan Electrochemical Society Meeting Abstracts 235, 1015-1015, 2019 | | 2019 |
| Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated Environments M Asokan, J Caperton, A Salunke, O Chyan, F Xu International Symposium on Microelectronics 2018 (1), 000655-000659, 2018 | | 2018 |
| Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects A Lambert, G Issac, A Salunke, L Lu, O Chyan International Symposium on Microelectronics 2018 (1), 000640-000646, 2018 | | 2018 |
| Adsorptive Removal of Malachite Green from Aqueous Solution Using Low Cost Adsorbent BM MARMAT, AS SALUNKE, NN GUND, JP SONAR, SA DOKHE, ... | | |
Subrata Kundu, Ph.D, FRSCPrincipal Scientist at CSIR-CECRI and Associate Editor-JMC A and Materials Advances (RSC)Verified email at cecri.res.in
