| Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices K Sinha, J Varghese, A Dasgupta Microelectronics Reliability 54 (3), 610-618, 2014 | 13 | 2014 |
| Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics JW Evans, K Sinha Microelectronics Reliability 80, 317-327, 2018 | 12 | 2018 |
| Development on fatigue life model of lead-free solder for first failure prediction FX Che, YC Ong, HW Ng, L Pan, C Glancey, K Sinha, R Fan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1608-1913, 2022 | 7 | 2022 |
| Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such … SU Arifeen, C Glancey, K Sinha US Patent 11,276,659, 2022 | 7 | 2022 |
| Predictive Solder Joint Reliability Modeling for Early Risk Assessment K Sinha, C Glancey, H Takiar, YC Ong, L Pan 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 330-334, 2020 | 7 | 2020 |
| Mechanics of Non Planar Interfaces in Flip-Chip Interconnects K Sinha | 5 | 2012 |
| Influence of BGA design parameters on solder joint reliability K Sinha, C Glancey 2021 IEEE 23rd electronics packaging technology conference (EPTC), 413-418, 2021 | 4 | 2021 |
| Reliability engineering for driver electronics in solid-state lighting products A Dasgupta, K Sinha, J Herzberger Solid state lighting reliability: Components to systems, 243-284, 2013 | 4 | 2013 |
| PCB design parameters of reducing copper trace crack under temperature cycle test W Chen, P Yang, K Sinha, C Glancey, L Pan, FX Che, YC Ong 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 673-677, 2022 | 3 | 2022 |
| Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application L Pan, FX Che, YC Ong, HW Ng, K Sinha, W Chen 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 668-672, 2022 | 3 | 2022 |
| Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6 V Liu, JM Chen, JA Pan, K Sinha, CL Gan, C Yoo, H Takiar 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 969-972, 2022 | 3 | 2022 |
| Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages FX Che, YC Ong, HW Ng, L Pan, K Sinha, C Glancey, G Kumar 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 420-425, 2023 | 2 | 2023 |
| Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects K Sinha, D Farley, T Kahnert, SD Solares, A Dasgupta, JFJ Caers, ... Journal of Adhesion Science and Technology 28 (12), 1167-1191, 2014 | 2 | 2014 |
| Au-Au ‘cold-weld’bond strength in adhesively bonded flip-chip interconnects K Sinha, D Farley, T Kahnert, A Dasgupta, JFJ Caers, XJ Zhao 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 2 | 2011 |
| Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects D Farley, T Kahnert, K Sinha, S Solares, A Dasgupta, JFJ Caers, XJ Zhao 2009 59th Electronic Components and Technology Conference, 67-73, 2009 | 2 | 2009 |
| Design optimization to Boost Solder Joint reliability Performance for SSD BGA package L Pan, FX Che, W Yu, YC Ong, HW Ng, KAB Tan, WW Lum, K Sinha, ... 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 674-677, 2023 | 1 | 2023 |
| Effect of Printed Circuit Board Design Parameters on Solder Joint Reliability for Memory Packages K Sinha, C Glancey, W Chen, P Yang, L Pan, FX Che, YC Ong, HW Ng 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 622-626, 2022 | 1 | 2022 |
| Semiconductor devices with flexible connector array K Sinha, X Qu US Patent 11,348,875, 2022 | 1 | 2022 |
| Circuit board with spaces for embedding components Q Nguyen, C Glancey, SU Arifeen, K Sinha US Patent App. 17/023,037, 2022 | 1 | 2022 |
| Mechanical strength of copper-silicon interface of planar metallization power modules K Sinha, A Dasgupta, R Beaupre, A Gowda ASME International Mechanical Engineering Congress and Exposition 48678, 87-93, 2008 | 1 | 2008 |
