V.Retnasamy Ph.D
V.Retnasamy Ph.D
MIET, MIEEE & MSPIE. School of Microelectronic Engineering, Universiti Malaysia Perlis
Verified email at unimap.edu.my
Title
Cited by
Cited by
Year
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
YB Kar, NA Talik, Z Sauli, JS Fei, V Retnasamy
Microelectronics International, 2013
162013
Shear stress analysis study using surface morphology correlation with aluminium ball adhesion
V Retnasamy, Z Sauli, MHA Aziz, RM Hatta, AHM Shapri, S Taniselass
2012 Fourth International Conference on Computational Intelligence …, 2012
132012
Interaction of surface roughness and copper ball adhesion using shearing simulation
V Retnasamy, Z Sauli, AHM Shapri, S Taniselass, R Vairavan, N Ramli
2012 Fourth International Conference on Computational Intelligence …, 2012
122012
Wire bond shear test simulation on sharp groove surface bond pad
Z Sauli, V Retnasamy, S Taniselass, AHM Shapri, R Vairavan
Advanced Materials Research 622, 647-651, 2013
112013
Shearing speed induced stress comparison on gold and copper ball interconnection
Z Sauli, V Retnasamy, NA Rahman, WMW Norhaimi, N Ramli, R Vairavan
2012 Fourth International Conference on Computational Intelligence …, 2012
112012
FDTD analysis of structured metallic nanohole films for LSPR-based biosensor
FA Said, PS Menon, T Kalaivani, MA Mohamed, A Abedini, S Shaari, ...
2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 1-4, 2015
102015
Measurement of PCI connector tilts using phase-shift fringe projection
V Retnasamy, MM Ratnam
The International Journal of Advanced Manufacturing Technology 38 (11-12 …, 2008
102008
5mm x 5mm copper-diamond composite slug stress evaluation on LED
R Vairavan, Z Sauli, V Retnasamy, P Ehkan, OT Say
2013 7th Asia Modelling Symposium, 78-81, 2013
82013
Polymer core BGA stress analysis at minimal vertical loading
Z Sauli, V Retnasamy, S Taniselass, NAZ Rahman, MHA Aziz
Advanced Materials Research 622, 639-642, 2013
82013
Gold ball shear stress analysis on different surface morphology
V Retnasamy, Z Sauli, NA Rahman, RM Hatta, R Vairavan, ...
2012 Fourth International Conference on Computational Intelligence …, 2012
82012
FAB stress analysis comparison between au and al on paladium bond pad
V Retnasamy, Z Sauli, S Haimi, NA Rahman
Australian Journal of Basic and Applied Sciences 6 (9), 229-235, 2012
82012
High Power LED Thermal and Stress Simulation on Copper Slug
R Vairavan, Z Sauli, V Retnasamy, RC Ismail, NIM Nor, NS Nadzri, ...
2013 UKSim 15th International Conference on Computer Modelling and …, 2013
72013
Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power
Z Sauli, V Retnasamy, R Vairavan, WMWN Haimi, H Kamarudin, NF Yih, ...
2013 UKSim 15th International Conference on Computer Modelling and …, 2013
72013
Stress analysis on through holes in PCB
Z Sauli, V Retnasamy, K Vengdasalam, MHA Aziz, RM Hatta, R Vairavan
2012 Fourth International Conference on Computational Intelligence …, 2012
62012
Shear ram height investigation for gold wire bond shear test
Z Sauli, V Retnasamy, AHM Shapri, S Taniselass, TS Ong
Advanced Materials Research 622, 1447-1450, 2013
52013
The optimization of ultrasonic power and bonding time for thermosonic flip chip bonding
MR Lim, Z Sauli, H Aris, V Retnasamy, C Lo, K Muniandy, N Khan, ...
AIP conference proceedings 2045 (1), 020094, 2018
42018
Heat Sink Fin Number Variation Analysis on Single Chip High Power LED
Z Sauli, R Vairavan, V Retnasamy
Applied Mechanics and Materials 487, 149-152, 2014
42014
Stress and Temperature Simulation Using Copper-Diamond Composite Slug
Z Sauli, V Retnasamy, R Vairavan, RC Ismail, N Khalid, MFC Husin, ...
2013 UKSim 15th International Conference on Computer Modelling and …, 2013
42013
Wire bond shear test simulation on hemispherical surface bond pad
Z Sauli, V Retnasamy, WMW Norhaimi, J Adnan, M Palianysamy
Advanced Materials Research 622, 643-646, 2013
42013
A short review on thermosonic flip chip bonding
S Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, MM Shahimin, ...
AIP conference proceedings 1885 (1), 020266, 2017
32017
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Articles 1–20