| FDTD analysis of structured metallic nanohole films for LSPR-based biosensor FA Said, PS Menon, T Kalaivani, MA Mohamed, A Abedini, S Shaari, ... 2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 1-4, 2015 | 21 | 2015 |
| Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS Y Boon Kar, N Azrina Talik, Z Sauli, J Siow Fei, V Retnasamy Microelectronics International 30 (1), 14-18, 2013 | 18 | 2013 |
| Shear stress analysis study using surface morphology correlation with aluminium ball adhesion V Retnasamy, Z Sauli, MHA Aziz, RM Hatta, AHM Shapri, S Taniselass 2012 Fourth International Conference on Computational Intelligence …, 2012 | 13 | 2012 |
| Interaction of surface roughness and copper ball adhesion using shearing simulation V Retnasamy, Z Sauli, AHM Shapri, S Taniselass, R Vairavan, N Ramli 2012 Fourth International Conference on Computational Intelligence …, 2012 | 13 | 2012 |
| Wire bond shear test simulation on sharp groove surface bond pad Z Sauli, V Retnasamy, S Taniselass, AHM Shapri, R Vairavan Advanced Materials Research 622, 647-651, 2013 | 11 | 2013 |
| Shearing speed induced stress comparison on gold and copper ball interconnection Z Sauli, V Retnasamy, NA Rahman, WMW Norhaimi, N Ramli, R Vairavan 2012 Fourth International Conference on Computational Intelligence …, 2012 | 10 | 2012 |
| Measurement of PCI connector tilts using phase-shift fringe projection V Retnasamy, MM Ratnam The International Journal of Advanced Manufacturing Technology 38, 1172-1180, 2008 | 10 | 2008 |
| A brief review on breast carcinoma and deliberation on current non invasive imaging techniques for detection R Vairavan, O Abdullah, PB Retnasamy, Z Sauli, MM Shahimin, ... Current Medical Imaging 15 (2), 85-121, 2019 | 8 | 2019 |
| 5mm x 5mm copper-diamond composite slug stress evaluation on LED R Vairavan, Z Sauli, V Retnasamy, P Ehkan, OT Say 2013 7th Asia Modelling Symposium, 78-81, 2013 | 8 | 2013 |
| High Power LED Thermal and Stress Simulation on Copper Slug R Vairavan, Z Sauli, V Retnasamy, RC Ismail, NIM Nor, NS Nadzri, ... 2013 UKSim 15th International Conference on Computer Modelling and …, 2013 | 8 | 2013 |
| Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power Z Sauli, V Retnasamy, R Vairavan, WMWN Haimi, H Kamarudin, NF Yih, ... 2013 UKSim 15th International Conference on Computer Modelling and …, 2013 | 8 | 2013 |
| Polymer core BGA stress analysis at minimal vertical loading Z Sauli, V Retnasamy, S Taniselass, NAZ Rahman, MHA Aziz Advanced Materials Research 622, 639-642, 2013 | 8 | 2013 |
| Barium strontium titanate (BST) thin film analysis on different layer and annealing temperature YC Teh, NR Ong, Z Sauli, JB Alcain, V Retnasamy AIP Conference Proceedings 1885 (1), 2017 | 7 | 2017 |
| A review: Application of adhesive bonding on semiconductor interconnection joints S Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, MM Shahimin, ... AIP Conference Proceedings 1885 (1), 2017 | 7 | 2017 |
| Stress analysis on through holes in PCB Z Sauli, V Retnasamy, K Vengdasalam, MHA Aziz, RM Hatta, R Vairavan 2012 Fourth International Conference on Computational Intelligence …, 2012 | 7 | 2012 |
| FAB stress analysis comparison between au and al on paladium bond pad V Retnasamy, Z Sauli, S Haimi, NA Rahman Australian Journal of Basic and Applied Sciences 6 (9), 229-235, 2012 | 7 | 2012 |
| The optimization of ultrasonic power and bonding time for thermosonic flip chip bonding MR Lim, Z Sauli, H Aris, V Retnasamy, C Lo, K Muniandy, N Khan, ... AIP conference proceedings 2045 (1), 2018 | 6 | 2018 |
| Effects of air temperature and velocity on the drying kinetics and product particle size of starch from arrowroot (Maranta arundinacae) AR Caparanga, RAL Reyes, RL Rivas, FC De Vera, V Retnasamy, H Aris EPJ Web of Conferences 162, 01084, 2017 | 6 | 2017 |
| Gold ball shear stress analysis on different surface morphology V Retnasamy, Z Sauli, NA Rahman, RM Hatta, R Vairavan, ... 2012 Fourth International Conference on Computational Intelligence …, 2012 | 6 | 2012 |
| A review on solder reflow and flux application for flip chip S Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, ... AIP Conference Proceedings 1885 (1), 2017 | 5 | 2017 |
Zaliman Sauli, PhDProfessor in Microelectronics, Universiti Malaysia PerlisVerified email at unimap.edu.my
