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Martin Schubert
Martin Schubert
Institut für Aufbau- und Verbindungstechnik der Elektronik, Technische Universität Dresden
Verified email at tu-dresden.de
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Year
Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials
S Kirsten, M Schubert, M Braunschweig, G Woldt, T Voitsekhivska, ...
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 719-724, 2014
172014
Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages?
T Tiedje, S Lüngen, M Schubert, M Luniak, K Nieweglowski, K Bock
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1065-1070, 2017
112017
Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load
M Schubert, S Kirsten, T Voitsekhivska, K Bock
2015 38th International Spring Seminar on Electronics Technology (ISSE), 129-133, 2015
62015
Flexible and stretchable redistribution layer with embedded chips for human-machine interface
M Schubert, L Wambera, O Mudrievska, K Nieweglowski, J Wagner, ...
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020
52020
Evaluation of nanoparticle inks on flexible and stretchable substrates for biocompatible application
M Schubert, L Rebohle, Y Wang, M Fritsch, K Bock, M Vinnichenko, ...
2018 7th Electronic System-Integration Technology Conference (ESTC), 1-6, 2018
52018
Screen printed conductive pastes for biomedical electronics
H Berg, M Schubert, S Friedrich, K Bock
2016 39th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2016
52016
Printed flexible microelectrode for application of nanosecond pulsed electric fields on cells
M Schubert, J Rasche, MM Laurila, T Vuorinen, M Mäntysalo, K Bock
Materials 12 (17), 2713, 2019
42019
3D printed flexible substrate with pneumatic driven electrodes for health monitoring
M Schubert, S Friedrich, K Bock, D Wedekind, S Zaunseder, H Malberg
2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017
42017
Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics
S Kirsten, M Schubert, J Uhlemann, KJ Wolter
2014 36th Annual International Conference of the IEEE Engineering in …, 2014
42014
Fluid dynamic load of polymers used as encapsulation material for implantable microsystems
S Kirsten, M Schubert, J Uhlemann, KJ Wolter
Biomedical Engineering/Biomedizinische Technik 58 (SI-1-Track-C …, 2013
32013
Additively manufactured Pneumatically Driven skin electrodes
M Schubert, M Schmidt, P Wolter, H Malberg, S Zaunseder, K Bock
Materials 11 (1), 19, 2017
22017
Package characterization of FET-based biochemical sensors
T Voitsekhivska, E Suthau, S Kirsten, M Schubert, F Zörgiebel, G Cuniberti, ...
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 725-729, 2014
22014
Evaluation of dispensed carbon nanotube ink on flexible substrates for biocompatible application
M Schubert, H Berg, S Friedrich, K Bock
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-5, 2016
12016
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