| Effect of gold content on the reliability of SnAgCu solder joints J Pan, J Silk, M Powers, P Hyland IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 31 | 2011 |
| A study of solder joint failure criteria J Pan, J Silk International Symposium on Microelectronics 2011 (1), 000694-000702, 2011 | 28 | 2011 |
| iNEMI Pb-Free alloy characterization project report: part I–program goals, experimental structure, alloy characterization, and test protocols for accelerated temperature cycling G Henshall, J Miremadi, R Parker, R Coyle, J Smetana, J Nguyen, W Liu, ... Proceedings of SMTAI 2012, 335-347, 2012 | 26 | 2012 |
| Effect of gold content on the microstructural evolution of SAC305 solder joints under isothermal aging M Powers, J Pan, J Silk, P Hyland Journal of electronic materials 41, 224-231, 2012 | 20 | 2012 |
| Thermal cycling reliability and failure mode of two ball grid array packages with high reliability Pb-free solder alloys R Coyle, C Johnson, D Hillman, R Parker, M Osterman, J Smetana, ... Proceedings of SMTA International, 436-456, 2019 | 10 | 2019 |
| iNEMI PB-FREE ALLOY CHARACTERIZATION PROJECT REPORT: PART VII-THERMAL FATIGUE RESULTS FOR LOW-AG ALLOYS K Sweatman, R Coyle, R Parker, K Howell, E Benedetto, J Smetana, ... | 10 | 2014 |
| Enhancing thermal fatigue reliability of Pb-free solder alloys with additions of bismuth and antimony R Coyle, C Johnson, D Hillman, T Pearson, M Osterman, J Smetana, ... Proceedings of SMTA International, 339-354, 2020 | 8 | 2020 |
| Jasbir Bath, Joe Smetana, Stuart Longgood, Andre Kleyner, Julie Silk, Ranjit Pandher, Eric Lundeen, and Jerome Noiray “Alloy Composition and Thermal Fatigue of High Reliability … R Coyle, D Hillman, C Johnson, R Parker, B Sandy-Smith, H Zhang, ... Proceedings of SMTAI, 2018 | 8 | 2018 |
| iNEMI Pb-Free Alloy Characterization Project Report: PART IX–Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life R Coyle, R Parker, J Smetana, E Benedetto, K Howell, K Sweatman, ... Proceedings of SMTAI 2015, 743-755, 2015 | 8 | 2015 |
| Jasbir Bath, Mitch Holtzer, Hongwen Zhang, Jerome Noiray, Frederic Duondel, Raiyo Aspandiar, and Jim Wilcox,“A Collaborative Industrial Consortia Program for Characterizing … R Coyle, R Parker, K Howell, D Hillman, J Smetana, G Thomas, ... Proceedings of SMTAI 2016, 188-196, 2016 | 7 | 2016 |
| Gold Embrittlement in Leadfree Solder C Hillman, N Blattau, J Arnold, T Johnston, S Gulbrandsen, DR Solutions, ... SMTA Journal 26 (4), 23-34, 2013 | 7 | 2013 |
| Double Reflow-Induced Brittle Interfacial Failures in Pb-free Ball Grid Array Solder Joints J Silk, G Wenger, R Coyle, J Goodbread, A Giamis Proceedings IPC APEX Expo Conference & Exhibition, 1131-1141, 2013 | 6 | 2013 |
| Pad cratering susceptibility testing with acoustic emission WB San, R Nordstrom, J Silk Proceedings of IPC APEX Expo, 2014 | 3 | 2014 |
| Detecting Interconnect Damage in Shock Using Acoustic Emission Detection WC Ralph, EE Benedetto, GN Morscher, K Newman, J Silk MEMS and Nanotechnology, Volume 5: Proceedings of the 2015 Annual Conference …, 2016 | 2 | 2016 |
| A Scanning-Probe Technique for Mapping the Hardness of Lead-Free Solders JL Hay, C Morillo, J Silk MRS Online Proceedings Library 1652, 1-8, 2014 | 2 | 2014 |
| Pad cratering susceptibility WB San, J Silk Proceedings of SMTA International Symposium, 2012 | 2 | 2012 |
| Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys T Pearson, R Coyle, M Osterman, F Hadian, D Hillman, C Johnson, ... Proceedings of SMTAI International, 2022 | 1 | 2022 |
| Effect of gold and copper on microstructural evolution and mechanical durability of SAC305 solder joints S Mukherjee, A Dasgupta, J Silk, LL Ong 2014 International Conference on Electronics Packaging (ICEP), 162-167, 2014 | 1 | 2014 |
| Inhibiting the Re-Deposition of AuSn4 on Au/Ni Metallization Pads by Varying the Accessibility of Cu in Isothermally Aged SAC305 Solder Joints S Mukherjee, A Dasgupta, J Silk, L Ong ASME International Mechanical Engineering Congress and Exposition 56390 …, 2013 | 1 | 2013 |
| iNEMI Pb-free alloy characterization project report: Thermal fatigue results for low and no-Ag alloys G Henshall, K Sweatman, K Howell, UM de Tino, J Miremadi, R Parker, ... 2012 35th IEEE/CPMT International Electronics Manufacturing Technology …, 2012 | 1 | 2012 |
