Kim S Siow
Kim S Siow
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National
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Cited by
Cited by
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma processes and polymers 3 (6‐7), 392-418, 2006
Mechanical properties of nano-silver joints as die attach materials
KS Siow
Journal of Alloys and Compounds 514, 6-19, 2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
KS Siow
Journal of Electronic Materials 43 (4), 947-961, 2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C
ST Chua, KS Siow
Journal of Alloys and Compounds 687, 486-498, 2016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study
KS Siow, YT Lin
Journal of Electronic Packaging 138 (2), 020804, 2016
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States
K SIOW, L Britcher, S Kumar, H JGriesser
Sains Malaysiana 47 (8), 1913-1922, 2018
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
TF Chen, KS Siow
Journal of Alloys and Compounds 866, 158783, 2021
Mechanical properties of nanocrystalline copper and nickel
KS Siow, AAO Tay, P Oruganti
Materials science and technology 20 (3), 285-294, 2004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review
KS Siow, S Kumar, HJ Griesser
Plasma Processes and Polymers 12 (1), 8-24, 2015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 6 (9), 583-592, 2009
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
KS Siow
Materials, Process, Equipment, and Reliability, Springer International …, 2019
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups
KS Siow, L Britcher, S Kumar, HJ Griesser
Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 11 (2), 133-141, 2014
Pitting corrosion of duplex stainless steels
KS Siow, TY Song, JH Qiu
Anti Corrosion Methods and Materials 48 (1), 31-37, 2001
Plasma polymerized carvone as an antibacterial and biocompatible coating
YW Chan, KS Siow, PY Ng, U Gires, BY Majlis
Materials Science and Engineering: C 68, 861-871, 2016
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
Electrical conductivity of porous silver made from sintered nanoparticles
AS Zuruzi, KS Siow
Electronic Materials Letters 11 (2), 308-314, 2015
Low Pressure Plasma Modifications for the Generation of Hydrophobic Coatings for Biomaterials Applications
KS Siow
Plasma Processes and Polymers,, 2018
Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate
KS Siow, M Manoharan
Materials Science and Engineering: A 404 (1-2), 244-250, 2005
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects
NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar
Technology in Society 62, 101329, 2020
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