| Applications of porous media combustion technology–a review MA Mujeebu, MZ Abdullah, MZA Bakar, AA Mohamad, MK Abdullah Applied energy 86 (9), 1365-1375, 2009 | 464 | 2009 |
| Comparison of physical and mechanical properties of PLA, ABS and nylon 6 fabricated using fused deposition modeling and injection molding M Lay, NLN Thajudin, ZAA Hamid, A Rusli, MK Abdullah, RK Shuib Composites Part B: Engineering 176, 107341, 2019 | 336 | 2019 |
| Combustion in porous media and its applications–A comprehensive survey MA Mujeebu, MZ Abdullah, MZA Bakar, AA Mohamad, RMN Muhad, ... Journal of environmental management 90 (8), 2287-2312, 2009 | 333 | 2009 |
| A review of investigations on liquid fuel combustion in porous inert media MA Mujeebu, MZ Abdullah, MZA Bakar, AA Mohamad, MK Abdullah Progress in Energy and Combustion Science 35 (2), 216-230, 2009 | 130 | 2009 |
| Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ... International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010 | 76 | 2010 |
| Converting dead leaf biomass into activated carbon as a potential replacement for carbon black filler in rubber composites M Lay, A Rusli, MK Abdullah, ZAA Hamid, RK Shuib Composites Part B: Engineering 201, 108366, 2020 | 68 | 2020 |
| Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling MK Abdullah, MZ Abdullah, MV Ramana, CY Khor, KA Ahmad, ... International Communications in Heat and Mass Transfer 36 (1), 51-58, 2009 | 58 | 2009 |
| Optimum tip gap and orientation of multi-piezofan for heat transfer enhancement of finned heat sink in microelectronic cooling MK Abdullah, NC Ismail, MA Mujeebu, MZ Abdullah, KA Ahmad, ... International Journal of Heat and Mass Transfer 55 (21-22), 5514-5525, 2012 | 55 | 2012 |
| Feasibility study of cogeneration in a plywood industry with power export to grid MA Mujeebu, S Jayaraj, S Ashok, MZ Abdullah, M Khalil Applied Energy 86 (5), 657-662, 2009 | 54 | 2009 |
| Effects of tip gap and amplitude of piezoelectric fans on the performance of heat sinks in microelectronic cooling MK Abdullah, NC Ismail, MZ Abdullah, MA Mujeebu, KA Ahmad, ZM Ripin Heat and Mass Transfer 48, 893-901, 2012 | 43 | 2012 |
| AN EXPERIMENTAL STUDY OF BRIQUETTING PROCESS OF TORRIFIED RUBBER SEED KERNEL AND PALM OIL SHELL MF Hamid, MY Idroas, MZ Ishak, ZA Zainal, MA Miskam, MK Abdullah | 41 | 2016 |
| Optimization of graphene conductive ink using solvent exchange techniques for flexible electronics applications YZN Htwe, MK Abdullah, M Mariatti Synthetic Metals 274, 116719, 2021 | 40 | 2021 |
| Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process CY Khor, MZ Abdullah, MK Abdullah, MA Mujeebu, D Ramdan, M Majid, ... International Journal of Heat and Mass Transfer 54 (9-10), 1861-1870, 2011 | 38 | 2011 |
| A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-chip scale packages (S-CSP) MK Abdullah, MZ Abdullah, MA Mujeebu, S Kamaruddin, ZM Ariff Journal of Reinforced Plastics and Composites 28 (20), 2527-2538, 2009 | 38 | 2009 |
| Water-based graphene/AgNPs hybrid conductive inks for flexible electronic applications YZN Htwe, MK Abdullah, M Mariatti Journal of Materials Research and Technology 16, 59-73, 2022 | 37 | 2022 |
| Influence of bed temperature on warpage, shrinkage and density of various acrylonitrile butadiene styrene (ABS) parts from fused deposition modelling (FDM) AA Rosli, RK Shuib, KMK Ishak, ZAA Hamid, MK Abdullah, A Rusli AIP Conference Proceedings 2267 (1), 2020 | 34 | 2020 |
| Fluid structure interaction of unsteady aerodynamics of flapping wing at low Reynolds number ZM Fairuz, MZ Abdullah, H Yusoff, MK Abdullah Engineering Applications of Computational Fluid Mechanics 7 (1), 144-158, 2013 | 34 | 2013 |
| Study of Flow Visualization in Stacked-Chip Scale Packages (S-CSP) MK Abdullah, MZ Abdullah, S Kamarudin, ZM Ariff, P Hussin, JJ Antony, ... 2006 IEEE International Conference on Semiconductor Electronics, 586-590, 2006 | 32 | 2006 |
| Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages CY Khor, MK Abdullah, MZ Abdullah, M Abdul Mujeebu, D Ramdan, ... Heat and mass transfer 46, 1315-1325, 2010 | 31 | 2010 |
| Evaluation of emulsified acrylate polymer and its pour point depressant performance A Admiral, MK Abdullah, A Ariffin Procedia Chemistry 19, 319-326, 2016 | 29 | 2016 |
Dr. M. Abdul MujeebuImam Abdulrahman Bin Faisal University, College of Architecture and Planning, Building EngineeringVerified email at iau.edu.sa
