| Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen Materials Letters 128, 42-45, 2014 | 120 | 2014 |
| Creep properties of low-temperature sintered nano-silver lap shear joints X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu Materials Science and Engineering: A 579, 108-113, 2013 | 78 | 2013 |
| A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air J Li, X Li, L Wang, YH Mei, GQ Lu Materials & Design 140, 64-72, 2018 | 75 | 2018 |
| Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver G Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ Lu IEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011 | 75 | 2011 |
| Additive manufacturing of toroid inductor for power electronics applications Y Yan, J Moss, KDT Ngo, Y Mei, GQ Lu IEEE Transactions on Industry Applications 53 (6), 5709-5714, 2017 | 68 | 2017 |
| Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen Mechanics of Materials 72, 61-71, 2014 | 68 | 2014 |
| High-temperature creep behavior of low-temperature-sintered nano-silver paste films G Chen, XH Sun, P Nie, YH Mei, GQ Lu, X Chen Journal of electronic materials 41, 782-790, 2012 | 64 | 2012 |
| Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate SY Zhao, X Li, YH Mei, GQ Lu Microelectronics Reliability 55 (12), 2524-2531, 2015 | 61 | 2015 |
| Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates Q Xu, Y Mei, X Li, GQ Lu Journal of Alloys and Compounds 675, 317-324, 2016 | 59 | 2016 |
| Simplification of low-temperature sintering nanosilver for power electronics packaging Y Mei, G Chen, Y Cao, X Li, D Han, X Chen Journal of electronic materials 42, 1209-1218, 2013 | 59 | 2013 |
| Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250and 400in Dry Air Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo IEEE Transactions on Device and Materials Reliability 11 (2), 316-322, 2010 | 59 | 2010 |
| Design and additive manufacturing of multipermeability magnetic cores L Liu, C Ding, S Lu, T Ge, Y Yan, Y Mei, KDT Ngo, GQ Lu IEEE Transactions on Industry Applications 54 (4), 3541-3547, 2018 | 51 | 2018 |
| Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests S Fu, Y Mei, X Li, C Ma, GQ Lu IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016 | 50 | 2016 |
| Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly Y Mei, G Chen, L Guo-Quan, X Chen International journal of adhesion and adhesives 35, 88-93, 2012 | 49 | 2012 |
| Reliability improvement of a double-sided IGBT module by lowering stress gradient using molybdenum buffers M Wang, Y Mei, W Liu, Y Xie, S Fu, X Li, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019 | 48 | 2019 |
| Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu Journal of Alloys and Compounds 777, 578-585, 2019 | 47 | 2019 |
| Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging S Fu, Y Mei, X Li, P Ning, GQ Lu Journal of Electronic Materials 44, 3973-3984, 2015 | 46 | 2015 |
| Rapid sintering nanosilver joint by pulse current for power electronics packaging Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013 | 44 | 2013 |
| Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018 | 43 | 2018 |
| Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material Y Mei, GQ Lu, X Chen, S Luo, D Ibitayo IEEE Transactions on Device and Materials Reliability 11 (2), 312-315, 2010 | 43 | 2010 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
