Zulkifli Mohamad Ariff
Zulkifli Mohamad Ariff
Polymer Engineering, Universiti Sains Malaysia
Verified email at - Homepage
Cited by
Cited by
Correlation between the acoustic and dynamic mechanical properties of natural rubber foam: Effect of foaming temperature
NN Najib, ZM Ariff, AA Bakar, CS Sipaut
Materials & Design 32 (2), 505-511, 2011
Properties of graphene nanopowder and multi-walled carbon nanotube-filled epoxy thin-film nanocomposites for electronic applications: The effect of sonication time and filler …
ZA Ghaleb, M Mariatti, ZM Ariff
Composites Part A: Applied Science and Manufacturing 58, 77-83, 2014
Vulcanization kinetics study of natural rubber compounds having different formulation variables
TH Khang, ZM Ariff
Journal of Thermal Analysis and Calorimetry 109 (3), 1545-1553, 2012
Effect of blowing agent concentration on cell morphology and impact properties of natural rubber foam
NN Najib, ZM Ariff, NA Manan, AA Bakar, CS Sipaut
Journal of Physical Science 20 (1), 13-25, 2009
Effect of foaming temperature and rubber grades on properties of natural rubber foams
ZM Ariff, Z Zakaria, LH Tay, SY Lee
Journal of applied polymer science 107 (4), 2531-2538, 2008
Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding
CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ...
International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010
Syntactic foams formulations, production techniques, and industry applications: A review
LO Afolabi, ZM Ariff, SFS Hashim, T Alomayri, S Mahzan, KA Kamarudin, ...
Journal of Materials Research and Technology 9 (5), 10698-10718, 2020
Synergy effects of graphene and multiwalled carbon nanotubes hybrid system on properties of epoxy nanocomposites
ZA Ghaleb, M Mariatti, ZM Ariff
Journal of Reinforced Plastics and Composites 36 (9), 685-695, 2017
Rheological Behaviour of Polypropylene Through Extrusion and Capillary Rheometry
ZM Ariff, A Ariffin, SS Jikan, NAA Rahim
Polypropylene, 29-48, 2012
Red-mud geopolymer composite encapsulated phase change material for thermal comfort in built-sector
LO Afolabi, ZM Ariff, PSM Megat-Yusoff, HH Al-Kayiem, AI Arogundade, ...
Solar Energy 181, 464-474, 2019
Effect of Foaming Temperature on Morphology and Compressive Properties of Ethylene propylene diena monomer rubber (EPDM) Foam
Z Zakaria, ZM Ariff, LH Tay, CS Sipaut
Malaysian Polymer Journal 2 (2), 22-30, 2007
Development and characterization of epoxy syntactic foam filled with epoxy hollow spheres.
SS Samsudin, ZM Ariff, Z Zakaria, AA Bakar
Express Polymer Letters 5 (7), 2011
Effect of filler treatments on rheological behavior of calcium carbonate and talc‐filled polypropylene hybrid composites
MSF Samsudin, ZAM Ishak, SS Jikan, ZM Ariff, A Ariffin
Journal of applied polymer science 102 (6), 5421-5426, 2006
Effects of parameter changes on the structure and properties of low‐density polyethylene foam
Z Zakaria, ZM Ariff, CS Sipaut
Journal of Vinyl and Additive Technology 15 (2), 120-128, 2009
Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process
CY Khor, MZ Abdullah, MK Abdullah, MA Mujeebu, D Ramdan, M Majid, ...
International Journal of Heat and Mass Transfer 54 (9-10), 1861-1870, 2011
A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-chip scale packages (S-CSP)
MK Abdullah, MZ Abdullah, MA Mujeebu, S Kamaruddin, ZM Ariff
Journal of Reinforced Plastics and Composites 28 (20), 2527-2538, 2009
Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package
CY Khor, MZ Abdullah, ZM Ariff, WC Leong
International Communications in Heat and Mass Transfer 39 (5), 670-680, 2012
Properties and Characterization of Kenaf-Filled Natural Rubber Latex Foam.
AFA Karim, H Ismail, ZM Ariff
BioResources 11 (1), 2016
Study of flow visualization in stacked-chip scale packages (S-CSP)
MK Abdullah, MZ Abdullah, S Kamarudin, ZM Ariff
International Communications in Heat and Mass Transfer 34 (7), 820-828, 2007
Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages
CY Khor, MK Abdullah, MZ Abdullah, M Abdul Mujeebu, D Ramdan, ...
Heat and mass transfer 46, 1315-1325, 2010
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