Gareth Hougham, G.G.Hougham, Gareth G. Hougham
Gareth Hougham, G.G.Hougham, Gareth G. Hougham
IBM, T.J. Watson Research Center
Verified email at purchase.edu
Title
Cited by
Cited by
Year
Atomic-beam alignment of inorganic materials for liquid-crystal displays
P Chaudhari, J Lacey, J Doyle, E Galligan, SCA Lien, A Callegari, ...
Nature 411 (6833), 56-59, 2001
4792001
Fluoropolymers 2
GG Hougham, PE Cassidy, K Johns, T Davidson
Springer Science & Business Media, 1999
2961999
Silicon chip carrier with conductive through-vias and method for fabricating same
DC Edelstein, PS Andry, LP Buchwalter, JA Casey, SA Goma, RR Horton, ...
US Patent 7,276,787, 2007
2572007
Polarization effects of fluorine on the relative permittivity in polyimides
G Hougham, G Tesoro, A Viehbeck, JD Chapple-Sokol
Macromolecules 27 (21), 5964-5971, 1994
2431994
Synthesis and properties of highly fluorinated polyimides
G Hougham, G Tesoro, J Shaw
Macromolecules 27 (13), 3642-3649, 1994
2401994
Influence of free volume change on the relative permittivity and refractive index in fluoropolyimides
G Hougham, G Tesoro, A Viehbeck
Macromolecules 29 (10), 3453-3456, 1996
2241996
Synthesis and properties of some new fluorine-containing polyimides
AC Misra, G Tesoro, G Hougham, SM Pendharkar
Polymer 33 (5), 1078-1082, 1992
1271992
Electronic structure and ultraviolet absorption spectrum of polyimide
JP LaFemina, G Arjavalingam, G Hougham
The Journal of chemical physics 90 (9), 5154-5160, 1989
1131989
Optics for high-performance servers and supercomputers
AF Benner, DM Kuchta, PK Pepeljugoski, RA Budd, G Hougham, ...
2010 Conference on Optical Fiber Communication (OFC/NFOEC), collocated …, 2010
962010
Is 25 Gb/s on-board signaling viable?
DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ...
IEEE Transactions on advanced packaging 32 (2), 328-344, 2009
932009
Silicon chip carrier with conductive through-vias and method for fabricating same
D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ...
US Patent App. 11/242,221, 2006
932006
Electronic component cooling using a heat transfer buffering capability
GLT Chiu, GG Hougham, LS Mok
US Patent 5,987,890, 1999
811999
The evolution of build-up package technology and its design challenges
ED Blackshear, M Cases, E Klink, SR Engle, RS Malfatt, DN de Araujo, ...
IBM journal of research and development 49 (4.5), 641-661, 2005
752005
Fluoropolymers 1: synthesis
GG Hougham, PE Cassidy, K Johns, T Davidson
Springer Science & Business Media, 2006
732006
Process of fabricating a precision microcontact printing stamp
G Hougham, P Fryer, R Nunes
US Patent 6,656,308, 2003
602003
Fluoropolymers: synthesis and applications
G Hougham, PE Cassidy, K Johns, J Davidson
Plenum Press, New York 1, 2, 1999
581999
Method for forming alignment layer by ion beam surface modification
AC Callegari, P Chaudhari, FE Doany, JP Doyle, EA Galligan, JH Glownia, ...
US Patent 6,665,033, 2003
572003
Heat transfer in electronic apparatus
GG Hougham, LS Mok
US Patent 6,109,039, 2000
512000
The synthesis and properties of polyimides made from perfluoro aromatic diamines
G Hougham, G Tesoro, J Shaw
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 198, 79-PMSE, 1989
441989
Emission mechanism in polyimide
G Arjavalingam, G Hougham, JP LaFemina
Polymer 31 (5), 840-844, 1990
421990
The system can't perform the operation now. Try again later.
Articles 1–20