Abhijit Dasgupta

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Ed HabtourThe University of WashingtonVerified email at uw.edu
Subhasis MukherjeeIC Packaging, AppleVerified email at apple.com
Gayatri CuddalorepattaPostdoctoral AssociateVerified email at seas.harvard.edu
Jingshi MengUniversity of Maryland, College ParkVerified email at umd.edu
Joseph VargheseGoogleVerified email at google.com
Daniel FarleyAnsys Germany GmbHVerified email at ansys.com
Daniel P. ColeU.S. Army Research OfficeVerified email at mail.mil
Koustav SinhaMicron Technology, Inc.Verified email at micron.com
Bongtae HanProfessor of Mechanical Engineering, University of MarylandVerified email at umd.edu
Bite Zhou, Ph.D.Failure Analysis R&D Engineer, Intel CorporationVerified email at intel.com
Thomas R. BielerMichigan State UniversityVerified email at egr.msu.edu
John W. EvansNASAVerified email at ieee.org
Samuel StantonUS Air Force AcademyVerified email at afacademy.af.edu
Majed A. MajeedAssociate Professor, Mechanical Engineering Dept., Kuwait UniversityVerified email at ku.edu.kw
Preeti ChauhanGoogle CorporationVerified email at intel.com
Craig HillmanDfR SolutionsVerified email at dfrsolutions.com
Elisabeth SmelaDepartment of Mechanical Engineering, University of MarylandVerified email at umd.edu
Ricky ValentinUniversity of Puerto RicoVerified email at upr.edu
Bavani BalakrisnanCorning Research & DevelopmentVerified email at terpalum.umd.edu
Santiago SolaresThe Catholic University of AmericaVerified email at cua.edu

Abhijit Dasgupta

Professor of Mechanical Engineering, University of Maryland

Verified email at umd.edu

Mechanics of Materials micromechanics nanomechanics reliability of electronic materials accelerated stress testing


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Solder creep-fatigue analysis by an energy-partitioning approach A Dasgupta, C Oyan, D Barker, M Pecht	299	1992
Material failure mechanisms and damage models A Dasgupta, M Pecht IEEE Transactions on Reliability 40 (5), 531-536, 1991	274	1991
Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties A Dasgupta, RK Agarwal, SM Bhandarkar Composites science and technology 56 (3), 209-223, 1996	259	1996
Physics-of-failure: an approach to reliable product development M Pecht, A Dasgupta Journal of the IES 38 (5), 30-34, 1995	247	1995
Orthotropic thermal conductivity of plain-weave fabric composites using a homogenization technique A Dasgupta, RK Agarwal Journal of composite materials 26 (18), 2736-2758, 1992	210	1992
Ultrasound-mediated drug delivery to the brain: principles, progress and prospects A Dasgupta, M Liu, T Ojha, G Storm, F Kiessling, T Lammers Drug Discovery Today: Technologies 20, 41-48, 2016	165	2016
Role of failure-mechanism identification in accelerated testing J Hu, D Barker, A Dasgupta, A Arora Journal of the IES 36 (4), 39-45, 1993	145	1993
Fibrosis imaging: current concepts and future directions M Baues, A Dasgupta, J Ehling, J Prakash, P Boor, F Tacke, F Kiessling, ... Advanced drug delivery reviews 121, 9-26, 2017	132	2017
A fundamental overview of accelerated testing analytical models H Caruso, A Dasgupta Journal of the IEST 41 (1), 16-20, 1998	125	1998
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3. 9Ag0. 6Cu solder alloy Q Zhang, A Dasgupta, P Haswell 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003	117	2003
Failure-mechanism models for creep and creep rupture J Li, A Dasgupta IEEE Transactions on Reliability 42 (3), 339-353, 1993	111	1993
The reliability physics approach to failure prediction modelling M Pecht, A Dasgupta, D Barker, CT Leonard Quality and Reliability Engineering International 6 (4), 267-273, 1990	106	1990
Quality conformance and qualification of microelectronic packages and interconnects M Pecht, A Dasgupta, JW Evans, JY Evans John Wiley & Sons, 1994	103	1994
PWB solder joint life calculations under thermal and vibrational loading D Barker, A Dasgupta, M Peeht Journal of the IES 35 (1), 17-25, 1992	102	1992
Combined vibrational and thermal solder joint fatigue—A generalized strain versus life approach D Barker, J Vodzak, A Dasgupta, M Pecht	100	1990
Large-scale model test on square box culvert backfilled with sand A Dasgupta, B Sengupta Journal of Geotechnical Engineering 117 (1), 156-161, 1991	98	1991
Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis Q Zhang, A Dasgupta, D Nelson, H Pallavicini	89	2005
Effective thermomechanical behavior of plain-weave fabric-reinforced composites using homogenization theory A Dasgupta, SM Bhandarkar	85	1994
Mechanistic model for the stress-strain response of double-layered PSA H Huang, A Dasgupta 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018	83	2018
Importance of coatings to optical fiber sensors embedded in'smart'structures A Dasgupta, JS Sirkis AIAA journal 30 (5), 1337-1343, 1992	83	1992

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