Zulkarnain Endut
Zulkarnain Endut
Senior Lecturer, Center of Foundation Studies For Agricultural Science, Universiti Putra Malaysia
Verified email at upm.edu.my - Homepage
Title
Cited by
Cited by
Year
Pseudocapacitive performance of vertical copper oxide nanoflakes
Z Endut, M Hamdi, WJ Basirun
Thin Solid Films 528, 213-216, 2013
722013
Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor
MASM Haniff, SM Hafiz, KA Abd Wahid, Z Endut, HW Lee, DCS Bien, ...
Scientific reports 5 (1), 1-10, 2015
362015
Supercapacitance of bamboo-type anodic titania nanotube arrays
Z Endut, M Hamdi, WJ Basirun
Surface and Coatings Technology 215, 75-78, 2013
302013
Graphene oxide electrocatalyst on MnO 2 air cathode as an efficient electron pump for enhanced oxygen reduction in alkaline solution
WJ Basirun, M Sookhakian, S Baradaran, Z Endut, MR Mahmoudian, ...
Scientific reports 5 (1), 1-7, 2015
292015
Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints
CK Shin, JY Huh
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000 …, 2000
21*2000
Nitrogen-doped multiwalled carbon nanotubes decorated with copper (I) oxide nanoparticles with enhanced capacitive properties
MASM Haniff, SM Hafiz, KA Wahid, Z Endut, MI Syono, NM Huang, ...
Journal of materials science 52 (11), 6280-6290, 2017
182017
An investigation on formation and electrochemical capacitance of anodized titania nanotubes
Z Endut, M Hamdi, WJ Basirun
Applied surface science 280, 962-966, 2013
182013
Step cut for dicing laminated wafer in a QFN package
S Abdullah
11*2008
Optimization and functionalization of anodized titania nanotubes for redox supercapacitor
Z Endut, M Hamdi, WJ Basirun
Thin Solid Films 549, 306-312, 2013
92013
Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging
Z Endut, I Ahmad, A Zaharim, NM Sukemi
2006 8th Electronics Packaging Technology Conference, 879-884, 2006
32006
Impact of low-k devices on failure mode of flip chip tensile pull test
Z Endut, I Ahmad, GLH Swee, NM Sukemi
2006 International Conference on Electronic Materials and Packaging, 1-5, 2006
12006
Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid.
WJ Basirun, IM Saeed, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ...
Journal of New Materials for Electrochemical Systems 19 (4), 2016
2016
Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor
DCS Bien, MASM Hanif, KA Abd Wahid, SM Hafz, HW Lee, NM Huang, ...
nature-Scientific Reports, 2015
2015
Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor
Scientific Reports, 14751, 2015
2015
Synthesis and Characterization of Anodic Titania Nanotubes for Supercapacitor Application
Z Endut
Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2013
2013
Dicing laminated wafer for QFN 3D stacked die packaging
S Abdullah, Z Endut, I Ahmad, A Jalar, SM Yusof
Advanced Materials Research 31, 202-205, 2008
2008
Faculty of Engineering, University Kebangsaan Malaysia, 43600 UKM Bangi, Selangor, Malaysia
I AHMAD, Z ENDUT, A ZAHARIM
Journal of Sustainability Science and Management 2 (1), 44-48, 2007
2007
A STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZER
I AHMAD, AZ ENDUT, A ZAHARIM, NM SUKEMI
Journal of Sustainability Science and Management 2 (1), 44-48, 2007
2007
Solder bump strength and failure mode of low-k flip chip device
Z Endut, I Ahmad, GLH Swee, NM Sukemi
2006 IEEE International Conference on Semiconductor Electronics, 991-995, 2006
2006
Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid
WJ Basirun, IM Saeedc, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ...
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