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Zulkarnain Endut
Zulkarnain Endut
Senior Lecturer, Center of Foundation Studies For Agricultural Science, Universiti Putra Malaysia
Verified email at upm.edu.my - Homepage
Title
Cited by
Cited by
Year
Pseudocapacitive performance of vertical copper oxide nanoflakes
Z Endut, M Hamdi, WJ Basirun
Thin Solid Films 528, 213-216, 2013
802013
Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor
MAS Mohammad Haniff, S Muhammad Hafiz, KAA Wahid, Z Endut, ...
Scientific reports 5 (1), 1-10, 2015
572015
Supercapacitance of bamboo-type anodic titania nanotube arrays
Z Endut, M Hamdi, WJ Basirun
Surface and Coatings Technology 215, 75-78, 2013
312013
Graphene oxide electrocatalyst on MnO2 air cathode as an efficient electron pump for enhanced oxygen reduction in alkaline solution
WJ Basirun, M Sookhakian, S Baradaran, Z Endut, MR Mahmoudian, ...
Scientific reports 5 (1), 1-7, 2015
292015
Nitrogen-doped multiwalled carbon nanotubes decorated with copper (I) oxide nanoparticles with enhanced capacitive properties
MASM Haniff, SM Hafiz, KA Wahid, Z Endut, MI Syono, NM Huang, ...
Journal of materials science 52 (11), 6280-6290, 2017
232017
An investigation on formation and electrochemical capacitance of anodized titania nanotubes
Z Endut, M Hamdi, WJ Basirun
Applied surface science 280, 962-966, 2013
182013
Optimization and functionalization of anodized titania nanotubes for redox supercapacitor
Z Endut, M Hamdi, WJ Basirun
Thin Solid Films 549, 306-312, 2013
122013
Investigation of warpage induced on molded strip of QFN package
U Mokhtar, R Rasid, I Ahmad, Z Endut, S Esa, K Krishnasamy
Solid State Science and Technology 16 (2), 189-197, 2008
32008
Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging
Z Endut, I Ahmad, A Zaharim, NM Sukemi
2006 8th Electronics Packaging Technology Conference, 879-884, 2006
32006
Impact of low-k devices on failure mode of flip chip tensile pull test
Z Endut, I Ahmad, GLH Swee, NM Sukemi
2006 International Conference on Electronic Materials and Packaging, 1-5, 2006
12006
Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid.
WJ Basirun, IM Saeed, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ...
Journal of New Materials for Electrochemical Systems 19 (4), 2016
2016
Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor
Scientific Reports, 14751, 2015
2015
Synthesis and Characterization of Anodic Titania Nanotubes for Supercapacitor Application
Z Endut
Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2013
2013
Dicing laminated wafer for QFN 3D stacked die packaging
S Abdullah, Z Endut, I Ahmad, A Jalar, SM Yusof
Advanced Materials Research 31, 202-205, 2008
2008
Faculty of Engineering, University Kebangsaan Malaysia, 43600 UKM Bangi, Selangor, Malaysia
I AHMAD, Z ENDUT, A ZAHARIM
Journal of Sustainability Science and Management 2 (1), 44-48, 2007
2007
Solder bump strength and failure mode of low-k flip chip device
Z Endut, I Ahmad, GLH Swee, NM Sukemi
2006 IEEE International Conference on Semiconductor Electronics, 991-995, 2006
2006
Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid Lead Corrosion and Formation of Lead Oxides from a Lead-air Cell in Methanesulfonic Acid
WJ Basirun, IM Saeedc, H Ghadimi, M Ladan, MR Mahmoudian, M Ebadi, ...
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