| Some thoughts on bondability and strength of gold wire bonding MN Zulkifli, S Abdullah, NK Othman, A Jalar Gold Bulletin 45, 115-125, 2012 | 36 | 2012 |
| Temperature cycling analysis for ball grid array package using finite element analysis M Nubli Zulkifli, Z Azhar Zahid Jamal, G Abdul Quadir Microelectronics International 28 (1), 17-28, 2011 | 30 | 2011 |
| Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire I Abdullah, MN Zulkifli, A Jalar, R Ismail Soldering & Surface Mount Technology 30 (3), 194-202, 2018 | 20 | 2018 |
| Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds MN Zulkifli, F Harun, A Jalar Microelectronics International 36 (2), 62-67, 2019 | 14 | 2019 |
| Relationship of mechanical and micromechanical properties with microstructural evolution of Sn-3.0 Ag-0.5 Cu (SAC305) solder wire under varied tensile strain rates and temperatures I Abdullah, MN Zulkifli, A Jalar, R Ismail, MA Ambak Journal of Electronic Materials 48, 2826-2839, 2019 | 13 | 2019 |
| Strength distribution of Au ball bond using nanoindentation approach MN Zulkifli, A Jalar, S Abdullah, IA Rahman, MAA Hamid Materials Science and Engineering: A 577, 189-196, 2013 | 11 | 2013 |
| Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)[Kesan penuaan isoterma dan … RAA Ab Rahim, MN Zulkifli, A Jalar, AM Afdzaluddin, KS Shyong Penerbit Universiti Kebangsaan Malaysia, 2020 | 10 | 2020 |
| Deformation behaviour of Sn-3.0 Ag-0.5 Cu (SAC305) solder wire under varied tensile strain rates I Abdullah, MN Zulkifli, A Jalar, R Ismail Soldering & Surface Mount Technology 29 (2), 110-117, 2017 | 9 | 2017 |
| Nanoindentation Test for the Strength Distrubution Analysis of Bonded Au Ball Bonds A Jalar, MN Zulkifli, S Abdullah Advanced Materials Research 148, 1163-1166, 2011 | 9 | 2011 |
| Effect of ultrasonic bonding parameters on the contact resistance and bondability performances of CIGS thin film photovoltaic solar panel H Basher, MN Zulkifli, A Jalar, M Daenen IEEE Journal of Photovoltaics 11 (2), 345-353, 2021 | 8 | 2021 |
| Rapid fabrication and characterization of PDMS microfluidics device using printed conductive silver ink AA Aziz, MAM Azmi, MN Zulkifli, AN Nordin, AK Bahrain, FZ Makmon, ... Materials Today: Proceedings 16, 1661-1667, 2019 | 7 | 2019 |
| Effect of applied load in the nanoindentation of gold ball bonds MN Zulkifli, A Jalar, S Abdullah, IA Rahman, NK Othman Journal of electronic materials 42, 1063-1072, 2013 | 7 | 2013 |
| Bondability of ultrasonic aluminum bonds on the molybdenum (de) selenide and molybdenum of back contact layer of copper indium gallium (de) selenide CIGS thin film photovoltaic … H Basher, MN Zulkifli, MK Rahmat, MGA Rahman, A Jalar, M Daenen Solar Energy 228, 516-522, 2021 | 5 | 2021 |
| Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization R Ismail, F Harun, MN Zulkifli, A Jalar, MA Bakar, S Abdullah IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 5 | 2015 |
| Comparative analysis of grid-connected bifacial and standard mono-facial photovoltaic solar systems NHA Kahar, NH Azhan, I Alhamrouni, MN Zulkifli, T Sutikno, A Jusoh Bulletin of Electrical Engineering and Informatics 12 (4), 1993-2004, 2023 | 4 | 2023 |
| Finite element analysis on the thermoelectric generator for the waste heat recovery of solar application MN Zulkifli, I Ilias, A Abas, WMW Muhamad AIP Conference Proceedings 1877 (1), 2017 | 4 | 2017 |
| The re-evaluation of mechanical properties of wire bonding A Jalar, MN Zulkifli, NK Othman, S Abdullah 2011 International Symposium on Advanced Packaging Materials (APM), 226-233, 2011 | 4 | 2011 |
| Microstructure Evaluation of Photovoltaic Solar Panel’s Interconnection: A Review SA Hamid, MN Zulkifli Materials Science Forum 1055, 27-35, 2022 | 3 | 2022 |
| Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds MN Zulkifli, A Jalar, F Harun IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2019 | 3 | 2019 |
| Hardness variation of ball bond wire bonding MN Zulkifli, A Jalar, S Abdullah, R Shamsudin Advanced Materials Research 399, 1048-1051, 2012 | 3 | 2012 |
Azman Jalarinstitute of microengineering and nanoelectronics (IMEN), universiti kebangsaan malaysiaVerified email at ukm.edu.my
