| Polar integration for exact space-time quadrature in time-domain integral equations J Pingenot, S Chakraborty, V Jandhyala IEEE transactions on antennas and propagation 54 (10), 3037-3042, 2006 | 35 | 2006 |
| Full wave analysis of RF signal attenuation in a lossy rough surface cave using a high order time domain vector finite element method J Pingenot, RN Rieben, DA White, DG Dudley Journal of Electromagnetic Waves and Applications 20 (12), 1695-1705, 2006 | 18 | 2006 |
| Electromagnetic coupled basis functions for an electronic circuit V Jandhyala, S Chakraborty, J Pingenot US Patent 7,644,381, 2010 | 11 | 2010 |
| Full wave analysis of RF signal attenuation in a lossy cave using a high order time domain vector finite element method J Pingenot, R Rieben, D White IEEE/ACES International Conference on Wireless Communications and Applied …, 2005 | 8 | 2005 |
| Towards system-level electromagnetic field simulation on computing clouds D Gope, V Jandhyala, X Wang, D Macmillen, R Camposano, ... 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 6 | 2011 |
| Efficient hierarchical discretization of off-chip power delivery network geometries for 2.5 D electrical analysis M Mondal, J Pingenot, V Jandhyala 2010 11th International Symposium on Quality Electronic Design (ISQED), 590-597, 2010 | 6 | 2010 |
| Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling D Gope, S Chatterjee, D De Araujo, S Chakraborty, J Pingenot, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2013 | 3 | 2013 |
| Removal of artificial resonances for divide and conquer analysis using boundary element method S Chakraborty, J Pingenot, M Mondal 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 2 | 2016 |
| A framework and simulator for parallel fast integral equation simulation of microelectronic structures V Jandhyala, C Yang, S Chakraborty, I Chowdhury, J Pingenot, ... 2006 IEEE Electrical Performane of Electronic Packaging, 287-290, 2006 | 2 | 2006 |
| Fast and accurate modeling of PCB differential trace skew compensation using ML J Reddy, J Mobley, D Wallace, J Pingenot, D de Araujo, C Filip, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 1 | 2021 |
| Cost Space Evolution for PDN Synthesis DN De Araujo, J Pingenot 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 1 | 2018 |
| Quantitative method of medication system interface evaluation J SHANTEAU, JDF PINGENOT CIN: Computers, Informatics, Nursing 25 (4), 211-220, 2007 | 1 | 2007 |
| Final Report for Time Domain Boundary Element and Hybrid Finite Element Simulation for Maxwell's Equations J Pingenot, V Jandhyala Lawrence Livermore National Lab.(LLNL), Livermore, CA (United States), 2007 | 1 | 2007 |
| An Explicit Time-Domain Hybrid Formulation Based on the Unified Boundary Condition N Madsen, BJ Fasenfest, D White, M Stowell, V Jandhyala, J Pingenot, ... Lawrence Livermore National Lab.(LLNL), Livermore, CA (United States), 2007 | 1 | 2007 |
| A hybrid FEM-BEM unified boundary condition with sub-cycling for electromagnetic radiation BJ Fasenfest, D White, M Stowell, R Rieben, R Sharpe, N Madsen, ... 2006 IEEE Antennas and Propagation Society International Symposium, 2757-2760, 2006 | 1 | 2006 |
| Differential forms basis functions for better conditioned integral equations BJ Fasenfest, D White, M Stowell, R Rieben, R Sharpe, N Madsen, ... 2005 IEEE Antennas and Propagation Society International Symposium 4, 292-295, 2005 | 1 | 2005 |
| A generalized TDIE framework for arbitrary time basis functions J Pingenot, C Yang, V Jandhyala, B Fasenfest, R Rieben, D White, ... 2005 IEEE Antennas and Propagation Society International Symposium 3, 443-446, 2005 | 1 | 2005 |
| One-Dimensional Deep Image Prior for Curve Fitting of S-Parameters from Electromagnetic Solvers S Ravula, V Gorti, B Deng, S Chakraborty, J Pingenot, B Mutnury, ... 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 1-9, 2023 | | 2023 |
| Efficient Boundary Element Methodology for Analyzing Interconnects in Multilayered PCBs G Bianconi, D de Araujo, J Pingenot, S Chakraborty 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | | 2023 |
| Removal of artificial resonances using boundary element method S Chakraborty, J Pingenot, M Mondal US Patent 10,586,008, 2020 | | 2020 |
