|Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits|
AS Budiman, HAS Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ...
Microelectronics Reliability 52 (3), 530-533, 2012
|The development of microstructure and the influence of processing route during equal channel angular drawing of pure aluminum|
U Chakkingal, AB Suriadi, PF Thomson
Materials Science and Engineering: A 266 (1-2), 241-249, 1999
|Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction|
AS Budiman, WD Nix, N Tamura, BC Valek, K Gadre, J Maiz, R Spolenak, ...
Applied Physics Letters 88 (23), 2006
|A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction|
AS Budiman, SM Han, JR Greer, N Tamura, JR Patel, WD Nix
Acta Materialia 56 (3), 602-608, 2008
|Microstructure development during equal channel angular drawing of Al at room temperature|
U Chakkingal, AB Suriadi, PF Thomson
Scripta Materialia 39 (6), 677-684, 1998
|Microstructure evolution and defect formation in Cu through-silicon vias (TSVs) during thermal annealing|
HAS Shin, BJ Kim, JH Kim, SH Hwang, AS Budiman, HY Son, KY Byun, ...
Journal of Electronic Materials 41, 712-719, 2012
|Indentation size effects in single crystal copper as revealed by synchrotron x-ray microdiffraction|
G Feng, AS Budiman, WD Nix, N Tamura, JR Patel
Journal of Applied Physics 104 (4), 2008
|Microcompression study of Al-Nb nanoscale multilayers|
Y Kim, AS Budiman, JK Baldwin, NA Mara, A Misra, SM Han
Journal of Materials Research 27 (3), 592-598, 2012
|Fabrication, microstructure, and mechanical properties of tin nanostructures|
MJ Burek, AS Budiman, Z Jahed, N Tamura, M Kunz, S Jin, SMJ Han, ...
Materials Science and Engineering: A 528 (18), 5822-5832, 2011
|Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe|
AS Budiman, G Illya, V Handara, WA Caldwell, C Bonelli, M Kunz, ...
Solar Energy Materials and Solar Cells 130, 303-308, 2014
|From cells to laminate: Probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite …|
SK Tippabhotla, I Radchenko, WJR Song, G Illya, V Handara, M Kunz, ...
Progress in Photovoltaics: research and applications 25 (9), 791-809, 2017
|Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction|
AS Budiman, KR Narayanan, N Li, J Wang, N Tamura, M Kunz, A Misra
Materials Science and Engineering: A 635, 6-12, 2015
|Plasticity in the nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron Laue x-ray microdiffraction|
AS Budiman, SM Han, N Li, QM Wei, P Dickerson, N Tamura, M Kunz, ...
Journal of Materials Research 27 (3), 599-611, 2012
|Effects of interface shear strength during failure of semicoherent metal–metal nanolaminates: An example of accumulative roll-bonded Cu/Nb|
I Radchenko, HP Anwarali, SK Tippabhotla, AS Budiman
Acta Materialia 156, 125-135, 2018
|Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment|
AS Budiman, CS Hau-Riege, WC Baek, C Lor, A Huang, HS Kim, ...
Journal of electronic materials 39, 2483-2488, 2010
|Probing phase transformations and microstructural evolutions at the small scales: Synchrotron X-ray microdiffraction for advanced applications in 3D IC (integrated circuits …|
I Radchenko, SK Tippabhotla, N Tamura, AS Budiman
Journal of Electronic Materials 45, 6222-6232, 2016
|Growth and structural characterization of epitaxial Cu/Nb multilayers|
AS Budiman, N Li, Q Wei, JK Baldwin, J Xiong, H Luo, D Trugman, QX Jia, ...
Thin Solid Films 519 (13), 4137-4143, 2011
|Fabrication, structure and mechanical properties of indium nanopillars|
G Lee, JY Kim, AS Budiman, N Tamura, M Kunz, K Chen, MJ Burek, ...
Acta Materialia 58 (4), 1361-1368, 2010
|Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction|
VA Handara, I Radchenko, SK Tippabhotla, KR Narayanan, G Illya, ...
Solar Energy Materials and Solar Cells 162, 30-40, 2017
|Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films|
CY Khoo, H Liu, WA Sasangka, RI Made, N Tamura, M Kunz, AS Budiman, ...
Journal of materials science 51, 1864-1872, 2016