| A highly reliable copper nanowire/nanoparticle ink pattern with high conductivity on flexible substrate prepared via a flash light-sintering technique SJ Joo, SH Park, CJ Moon, HS Kim ACS applied materials & interfaces 7 (10), 5674-5684, 2015 | 143 | 2015 |
| Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics SJ Joo, HJ Hwang, HS Kim Nanotechnology 25 (26), 265601, 2014 | 138 | 2014 |
| Copper nanoparticle/multiwalled carbon nanotube composite films with high electrical conductivity and fatigue resistance fabricated via flash light sintering HJ Hwang, SJ Joo, HS Kim ACS applied materials & interfaces 7 (45), 25413-25423, 2015 | 79 | 2015 |
| Two-step flash light sintering of copper nanoparticle ink to remove substrate warping CH Ryu, SJ Joo, HS Kim Applied Surface Science 384, 182-191, 2016 | 65 | 2016 |
| UV-assisted flash light welding process to fabricate silver nanowire/graphene on a PET substrate for transparent electrodes WH Chung, SH Park, SJ Joo, HS Kim Nano Research 11, 2190-2203, 2018 | 64 | 2018 |
| A review on intense pulsed light sintering technologies for conductive electrodes in printed electronics YR Jang, SJ Joo, JH Chu, HJ Uhm, JW Park, CH Ryu, MH Yu, HS Kim International Journal of Precision Engineering and Manufacturing-Green …, 2021 | 57 | 2021 |
| Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes MH Yu, SJ Joo, HS Kim Nanotechnology 28 (20), 205205, 2017 | 50 | 2017 |
| Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate EB Jeon, SJ Joo, H Ahn, HS Kim Thin Solid Films 603, 382-390, 2016 | 46 | 2016 |
| Damage detection and self-healing of carbon fiber polypropylene (CFPP)/carbon nanotube (CNT) nano-composite via addressable conducting network SJ Joo, MH Yu, WS Kim, HS Kim Composites Science and Technology 167, 62-70, 2018 | 44 | 2018 |
| Efficiency enhancement in dye-sensitized solar cells using the shape/size-dependent plasmonic nanocomposite photoanodes incorporating silver nanoplates HJ Hwang, SJ Joo, SA Patil, HS Kim Nanoscale 9 (23), 7960-7969, 2017 | 42 | 2017 |
| Design and manufacture of automotive composite front bumper assemble component considering interfacial bond characteristics between over-molded chopped glass fiber … SJ Joo, MH Yu, WS Kim, JW Lee, HS Kim Composite Structures 236, 111849, 2020 | 39 | 2020 |
| Intense pulsed light sintering of Cu nano particles/micro particles-ink assisted with heating and vacuum holding of substrate for warpage free printed electronic circuit CH Ryu, SJ Joo, HS Kim Thin Solid Films 675, 23-33, 2019 | 27 | 2019 |
| In situ fabrication of copper electrodes on carbon-fiber-reinforced polymer (CFRP) for damage monitoring by printing and flash light sintering SJ Joo, MH Yu, EB Jeon, HS Kim Composites Science and Technology 142, 189-197, 2017 | 27 | 2017 |
| Flash light sintering of ag mesh films for printed transparent conducting electrode CJ Moon, I Kim, SJ Joo, WH Chung, TM Lee, HS Kim Thin Solid Films 629, 60-68, 2017 | 26 | 2017 |
| Warpage simulation of a multilayer printed circuit board and microelectronic package using the anisotropic viscoelastic shell modeling technique that considers the initial warpage DH Kim, SJ Joo, DO Kwak, HS Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 26 | 2016 |
| Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test SJ Joo, B Park, DH Kim, DO Kwak, IS Song, J Park, HS Kim Journal of Micromechanics and Microengineering 25 (3), 035021, 2015 | 18 | 2015 |
| An investigation into methanol oxidation reactions and CO, OH adsorption on Pt-Ru-Mo catalysts for a direct methanol fuel cell SH Park, SJ Joo, HS Kim Journal of the Electrochemical Society 161 (4), F405, 2014 | 16 | 2014 |
| Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board JH Chu, SJ Joo, HS Kim Thin Solid Films 680, 1-11, 2019 | 10 | 2019 |
| Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards DH Kim, SJ Joo, DO Kwak, HS Kim Journal of Micromechanics and Microengineering 25 (10), 105016, 2015 | 10 | 2015 |
| Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB) SJ Joo, B Park, DH Kim, DO Kwak, J Park, HS Kim Journal of Micromechanics and Microengineering 26 (4), 045006, 2016 | 4 | 2016 |
