Effect of Al addition to bulk microstructure, IMC formation, wetting and mechanical properties of low-Ag SAC solder K Maslinda, AS Anasyida, MS Nurulakmal Journal of Materials Science: Materials in Electronics 27, 489-502, 2016 | 34 | 2016 |
Effect of substrate roughness and PVD deposition temperatures on hardness and wear performance of AlCrN-coated WC-Co CL Ling, MAM Yajid, MN Tamin, M Kamarudin, MAA Taib, N Nosbi, ... Surface and Coatings Technology 436, 128304, 2022 | 18 | 2022 |
Sintering and grain growth control of high dense YIG WFFW Ali, NS Abdullah, M Kamarudin, MF Ain, ZA Ahmad Ceramics International 42 (12), 13996-14005, 2016 | 16 | 2016 |
Fatigue assessment of steel wire rope M Kamarudin, MJ Jamaluddin, MN Tamin AIP Conference Proceedings 2068 (1), 2019 | 3 | 2019 |
Numerical Framework for Fatigue Life Prediction of Steel Wire Ropes Employing Damage-based Failure Models MF Abdulhamid, M Kamarudin, HS Kang, AS Kader, MN Tamin, S Ahmad, ... Proceedings of the 29th European Safety and Reliability Conference (ESREL …, 2019 | 3 | 2019 |
Effect of Aluminium and Silicon to IMC Formation in Low Ag-SAC Solder K. Maslinda, A.S. Anasyida, M.S. Nurulakmal Materials Science Forum 819, 63-67, 2015 | 3* | 2015 |
Isothermal Aging of Low-Ag SAC with Al addition MKN Nadhirah, K Maslinda, MS Nurulakmal, AS Anasyida Procedia Chemistry 19, 492-497, 2016 | 2 | 2016 |
Effects of different lay angles on characteristic fatigue responses of steel wire ropes M Kamarudin, Z Ahmad, AN Sung, M Johar, MN Tamin AIP Conference Proceedings 2676 (1), 2022 | | 2022 |
Residual Properties of the Drawn Steel Wires for Damage-Based Fretting Fatigue Models of the Wire Ropes M Kamarudin, Z Ahmad, MN Tamin Materials Science Forum 1010, 71-78, 2020 | | 2020 |
Investigation of YIG’s Active Site Using Density Functional Theory WFF Wan Ali, M Kamarudin, NS Abdullah, ZA Ahmad Materials Science Forum 888, 76-80, 2017 | | 2017 |
Effect of Al Addition to IMC Formation, Mechanical and Wetting Properties of Low-Ag SAC Solder Alloy M Kamarudin Universiti Sains Malaysia, 2015 | | 2015 |
Microstructure, Wettability and IMC Formation of Low-Ag SAC Solder on Cu Substrate M Kamarudin, MS Nurulakmal, AS Anasyida Advanced Materials Research 1024, 223-226, 2014 | | 2014 |
EFFECT OF ALUMINIUM AND SILICON ADDITION TO THE MICROSTRUCTURE OF LOW Ag-SAC SOLDER ALLOY K Maslinda, MS Nurulakmal, AS Anasyida, R Sivakumar | | |