A review on thermoelectric renewable energy: Principle parameters that affect their performance MH Elsheikh, DA Shnawah, MFM Sabri, SBM Said, MH Hassan, ... Renewable and sustainable energy reviews 30, 337-355, 2014 | 578 | 2014 |
Current developments in fluorescent PET (photoinduced electron transfer) sensors and switches B Daly, J Ling, AP De Silva Chemical Society Reviews 44 (13), 4203-4211, 2015 | 407* | 2015 |
A review on nanostructures of high-temperature thermoelectric materials for waste heat recovery R Ovik, BD Long, MC Barma, M Riaz, MFM Sabri, SM Said, R Saidur Renewable and sustainable energy reviews 64, 635-659, 2016 | 146 | 2016 |
Recent advances on Mg2Si1− xSnx materials for thermoelectric generation MBA Bashir, SM Said, MFM Sabri, DA Shnawah, MH Elsheikh Renewable and Sustainable Energy Reviews 37, 569-584, 2014 | 74 | 2014 |
Implementation of the problem-based learning approach in the Department of Electrical Engineering, University of Malaya SM Said, FRM Adikan, S Mekhilef, NA Rahim European journal of engineering education 30 (1), 129-136, 2005 | 66 | 2005 |
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications DA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che Journal of Electronic Materials, 1-28, 2012 | 64 | 2012 |
Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5 Cu solder alloy bearing Fe for electronics applications DAA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che Materials Science and Engineering: A, 2012 | 53 | 2012 |
Blue phase liquid crystal: strategies for phase stabilization and device development MDA Rahman, SM Said, S Balamurugan Science and technology of advanced materials 16 (3), 033501, 2015 | 48 | 2015 |
A REVIEW ON THE FABRICATION OF POLYMER-BASED THERMOELECTRIC MATERIALS AND FABRICATION METHODS SMS M.A.KAMARUDIN,SR.SAHAMIR ,R.S.DATTA,B.D.LONG,M.F.M THE SCIENTIFIC WORLD JOURNAL, 2013 | 48 | 2013 |
A review on the fabrication of polymer-based thermoelectric materials and fabrication methods MA Kamarudin, SR Sahamir, RS Datta, BD Long, MF Mohd Sabri, ... The Scientific World Journal 2013, 2013 | 48 | 2013 |
A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints DAA Shnawah, MFBM Sabri, IA Badruddin, S Said Microelectronics international, 2012 | 46 | 2012 |
Microstructural stability of Sn–1Ag–0.5 Cu–xAl (x= 1, 1.5, and 2 wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties MFM Sabri, DA Shnawah, IA Badruddin, SBM Said, FX Che, T Ariga Materials characterization 78, 129-143, 2013 | 40 | 2013 |
Effect of Ag content and the minor alloying element Fe on the mechanical properties and microstructural stability of Sn-Ag-Cu solder alloy under high-temperature annealing DA Shnawah, MFM Sabri, IA Badruddin, SBM Said, T Ariga, FX Che Journal of electronic materials 42 (3), 470-484, 2013 | 40 | 2013 |
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5 Cu solder alloy MH Mahdavifard, MFM Sabri, DA Shnawah, SM Said, IA Badruddin, ... Microelectronics Reliability 55 (9-10), 1886-1890, 2015 | 39 | 2015 |
Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn–Ag–Cu solder alloy NAAM Amin, DA Shnawah, SM Said, MFM Sabri, H Arof Journal of alloys and compounds 599, 114-120, 2014 | 37 | 2014 |
Novel Fe-containing Sn–1Ag–0.5 Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products DAA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che Microelectronics Reliability, 2012 | 37 | 2012 |
Energy efficiency of a building in the eastern province of Saudi Arabia: parametric analysis with DOE2. 1A SAM SAID, MA Abdelrahman ASHRAE transactions 95, 147-152, 1989 | 25 | 1989 |
Synthesis and characterization of protic ionic liquids as thermoelectrochemical materials TA Siddique, S Balamurugan, SM Said, NA Sairi, W Normazlan RSC advances 6 (22), 18266-18278, 2016 | 24 | 2016 |
Effects of aging on Sn–1Ag–0.5 Cu solder alloys containing 0.1 wt.% and 0.5 wt.% Al MFM Sabri, DA Shnawah, IA Badruddin, SBM Said Journal of alloys and compounds 582, 437-446, 2014 | 24 | 2014 |
Microstructure and Tensile Properties of Sn-1Ag-0.5 Cu Solder Alloy Bearing Al for Electronics Applications DAA Shnawah, SBM Said, MFM Sabri, IA Badruddin, TG Hoe, FX Che, ... Journal of electronic materials, 1-10, 2012 | 24 | 2012 |