| Molecular dynamics modeling of epoxy resins using the reactive interface force field GM Odegard, SU Patil, PP Deshpande, K Kanhaiya, JJ Winetrout, ... Macromolecules 54 (21), 9815-9824, 2021 | 57 | 2021 |
| Interfacial characteristics between flattened CNT stacks and polyimides: A molecular dynamics study SU Patil, MS Radue, WA Pisani, P Deshpande, H Xu, H Al Mahmud, ... Computational Materials Science 185, 109970, 2020 | 41 | 2020 |
| Reactive molecular dynamics simulation of epoxy for the full cross-linking process SU Patil, SP Shah, M Olaya, PP Deshpande, M Maiaru, GM Odegard ACS Applied Polymer Materials 3 (11), 5788-5797, 2021 | 40 | 2021 |
| Interfacial modeling of flattened CNT composites with cyanate ester and PEEK polymers WA Pisani, MS Radue, SU Patil, GM Odegard Composites Part B: Engineering 211, 108672, 2021 | 36 | 2021 |
| Understanding the origin of the low cure shrinkage of polybenzoxazine resin by computational simulation PS Gaikwad, AS Krieg, PP Deshpande, SU Patil, JA King, M Maiaru, ... ACS Applied Polymer Materials 3 (12), 6407-6415, 2021 | 33 | 2021 |
| Process modeling and characterization of thermoset composites for residual stress prediction SP Shah, SU Patil, CJ Hansen, GM Odegard, M Maiarù Mechanics of Advanced Materials and Structures 30 (3), 486-497, 2023 | 28 | 2023 |
| Prediction of the interfacial properties of high-performance polymers and flattened CNT-reinforced composites using molecular dynamics PP Deshpande, MS Radue, P Gaikwad, S Bamane, SU Patil, WA Pisani, ... Langmuir 37 (39), 11526-11534, 2021 | 28 | 2021 |
| Multi-scale Approach to Predict Cure-Induced Residual Stresses in an Epoxy System S Patil, S Shah, P Deshpande, K Kashmari, M Olaya, G Odegard, ... Proceedings of the American Society for Composites — Thirty-fifth …, 2020 | 21 | 2020 |
| Multiscale modeling for virtual manufacturing of thermoset composites S Shah, S Patil, P Deshpande, A Krieg, K Kashmari, H Al Mahmud, J King, ... AIAA Scitech 2020 Forum, 0882, 2020 | 21 | 2020 |
| Multiscale modelling of the cure process in thermoset polymers using ICME PP Deshpande, S Shah, S Patil, K Kashmari, M Olaya, GM Odegard, ... Proceedings of the American Society for Composites — Thirty-fifth …, 2020 | 16 | 2020 |
| Accurate predictions of thermoset resin glass transition temperatures from all-atom molecular dynamics simulation GM Odegard, SU Patil, PS Gaikwad, P Deshpande, AS Krieg, SP Shah, ... Soft Matter 18 (39), 7550-7558, 2022 | 12 | 2022 |
| A multi-scale approach for modelling the cure of thermoset polymers within ICME PP Deshpande, S Shah, S Patil, K Kashmari, GM Odegard, M Maiaru | 8 | 2019 |
| Prediction of residual stress build-up in polymer matrix composite during cure using a two-scale approach S Patil, S Shah, P DESHPANDE, K Kashmari, G ODEGARD, M MAIARà Proceedings of the American Society for Composites — Thirty-fourth …, 2019 | 7 | 2019 |
| Mechanical response of polymer/BN composites investigated by molecular dynamics method G Sachdeva, SU Patil, SS Bamane, PP Deshpande, WA Pisani, ... Journal of Materials Research 37 (24), 4533-4543, 2022 | 5 | 2022 |
| Molecular dynamics study to predict thermo-mechanical properties of dgebf/detda epoxy as a function of crosslinking density SU Patil, SP Shah, MN Olaya, PP Deshpande, M Maiaru, GM Odegard arXiv preprint arXiv:2108.00933, 2021 | 5 | 2021 |
| Multiscale modeling of thermoset composite to predict process-induced residual stresses S Shah, S Patil, P Deshpande, K Kashmari, GM Odegard, M Maiaru International Conference on Composite Materials (22nd: 2019: Melboune, VIC …, 2019 | 5 | 2019 |
| Probing the Influence of Surface Chemical Functionalization on Graphene Nanoplatelets-Epoxy Interfacial Shear Strength Using Molecular Dynamics H Al Mahmud, SU Patil, MS Radue, GM Odegard Nanomaterials 13 (2), 287, 2023 | 3 | 2023 |
| Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cure SU Patil, AS Krieg, LK Odegard, U Yadav, JA King, M Maiaru, ... Soft matter 19 (35), 6731-6742, 2023 | 3 | 2023 |
| Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical Properties K Kashmari, H Al Mahmud, SU Patil, WA Pisani, P Deshpande, M Maiaru, ... ACS applied engineering materials 1 (11), 3167-3177, 2023 | 2 | 2023 |
| Process modelling the cure of bisphenol-A Epoxy/Jeffamine system using ICME PP DESHPANDE, S Shah, SU PATIL, M OLAYA, GM ODEGARD, ... Proceedings of the American Society for Composites— Thirty-Sixth Technical …, 2021 | 2 | 2021 |
Gregory M. OdegardMichigan Technological UniversityVerified email at mtu.edu
